TE0741-05-G2C-1-A

$1,304.49

Description：MODULE FPGA KINTEX
Series：Kintex™-7

SKU:bae0b3f8d8d1 Category: Microcontrollers, Microprocessor, FPGA Modules Brand: Trenz Electronic GmbH

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Product introduction

Product Detailed Parameters

Description：MODULE FPGA KINTEX
Series：Kintex™-7
Mfr：Trenz Electronic GmbH
Package：Bulk
Module/Board Type：FPGA
Core Processor：Xilinx Kintex-7 FPGA XC7K410T-2FBG676C
Co-Processor：-
Speed：-
Flash Size：32MB
RAM Size：-
Connector Type：Board-to-Board (BTB) Socket
Size / Dimension：1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature：0°C ~ 70°C

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TE0741-05-G2C-1-A

Overview

The TE0741-05-G2C-1-A is an FPGA System-on-Module manufactured by Trenz Electronic GmbH. It utilizes the AMD Xilinx Kintex-7 XC7K410T-2FBG676C as its core processor. The module integrates 32 MByte of QSPI Flash memory for configuration and storage. Physically, the module measures 4 x 5 cm, providing a compact form factor suitable for embedded applications requiring high-performance programmable logic capabilities within a standardized footprint.

Feature Summary

Integrates AMD Xilinx Kintex-7 FPGA technology for complex programmable logic implementation
Includes onboard 32 MByte QSPI Flash for non-volatile data storage and configuration
Designed as a compact System-on-Module with a 4 x 5 cm footprint

Applications

Embedded systems requiring high-density programmable logic
Industrial control applications needing reliable FPGA processing
Communication infrastructure modules utilizing Kintex-7 capabilities

Procurement Notes

Verify the specific speed grade and package variant against project requirements before ordering. Confirm that the integrated 32 MByte QSPI Flash meets the storage needs for the target application firmware. Ensure compatibility with the intended carrier board interface specifications to guarantee proper signal integrity and power delivery for the Kintex-7 device.

Selection Notes

Select this module when a dedicated FPGA solution based on the Kintex-7 architecture is required in a small form factor. It is appropriate for designs where the combination of programmable logic and onboard flash is necessary without external memory components. Consider the 4 x 5 cm dimensions for space-constrained enclosures and verify thermal management requirements for the FBG676C package.

Part Context

This component belongs to the Trenz Electronic FPGA Module series, which provides pre-integrated AMD Xilinx devices. The TE0741-05-G2C-1-A specifically targets applications leveraging the Kintex-7 family's DSP slices and high-speed transceivers. It serves as a building block for custom hardware designs, abstracting the complexity of bare FPGA packaging into a ready-to-use system-on-module format.