TE0745-01-35-1C

Overview

The TE0745-01-35-1C is a System-on-Module (SOM) manufactured by Trenz Electronic GmbH, featuring the AMD Zynq-7000 Z-7035 device. It integrates an ARM Cortex-A9 processor with 1 GB of DDR3L memory and 32 MB of flash storage. The module measures 52 mm x 76 mm and operates within a commercial temperature range of 0°C to 70°C. Connectivity includes Samtec UFPS interfaces for flexible board integration.

Feature Summary

• Integrates AMD Zynq-7000 SoC with dual-core ARM Cortex-A9 processing capability
• Provides 1 GB DDR3L memory and 32 MB non-volatile flash storage
• Utilizes Samtec UFPS connectors for compact and reliable interconnection

Applications

• Industrial automation control systems
• Embedded IoT gateway devices
• Portable medical instrumentation

Procurement Notes

Verify the specific revision suffix and manufacturing date code against current production status. Confirm compatibility with baseboard designs regarding the Samtec UFPS connector pitch and electrical signaling requirements. Ensure environmental specifications meet operational thermal constraints.

Selection Notes

Select this module when a compact form factor is required alongside integrated FPGA and ARM processing capabilities. Consider the 52x76 mm footprint for space-constrained enclosures. Validate that the 32 MB flash capacity suffices for the target application's firmware and data storage needs.

Part Context

This component belongs to the TE0745 family of embedded modules designed for high-performance computing in small packages. It leverages the Zynq-7000 architecture to combine programmable logic with hard processor systems, offering versatility for mixed-signal applications.

Replacement Considerations

Consult official documentation for direct pin-compatible substitutes within the same series. Verify functional equivalence if considering alternative SoC families or memory configurations from other manufacturers.