TE0745-01-45-1C

Overview

The TE0745-01-45-1C is a System-on-Module (SOM) manufactured by Trenz Electronic GmbH, featuring the AMD Zynq-7000 SoC with the XC7Z045-1FBG676C device. It integrates an ARM Cortex-A9 processor core and includes 1GB of DDR3L memory and 32MB of flash storage. The module provides a compact computing solution designed for embedded applications requiring high performance in a small form factor.

Feature Summary

• Integrates AMD Zynq-7000 SoC with dual-core ARM Cortex-A9 processors
• Includes onboard 1GB DDR3L memory and 32MB flash storage
• Designed as a compact System-on-Module for embedded integration

Applications

• Industrial automation control systems
• Embedded data acquisition modules
• Portable medical instrumentation

Procurement Notes

Verify the specific ordering suffix to ensure compatibility with required memory configurations and temperature ranges. Confirm that the FBG676C package variant matches the target carrier board design constraints. Review the official datasheet for pinout definitions and electrical specifications before finalizing procurement orders.

Selection Notes

Select this module when a complete Zynq-7045 solution with integrated memory is required. It simplifies design by providing a pre-certified SOM compared to discrete component layouts. Ensure the application environment supports the operating temperature range specified for the -1C device grade.

Part Context

This part belongs to the TE0745 family of Trenz Electronic modules, which are based on the AMD Zynq-7000 series. These modules are engineered to accelerate development cycles by offering a ready-to-use hardware platform. They serve as the central processing unit for various custom carrier board designs.

Replacement Considerations

TE0745-01-45-2I