TE0745-02-30-1IA

Overview

The TE0745-02-30-1IA is a carrier board designed for the Xilinx Zynq UltraScale+ MPSoC family, specifically supporting the XCZU3EG or XCZU3CG devices. This module integrates essential peripheral interfaces including Gigabit Ethernet, USB 3.0, and PCIe Gen3 to facilitate rapid prototyping and development of embedded systems based on the Zynq architecture.

Feature Summary

• Supports Xilinx Zynq UltraScale+ MPSoC with integrated ARM Cortex-A53 processors and FPGA fabric
• Provides high-speed connectivity via Gigabit Ethernet and USB 3.0 interfaces
• Includes PCIe Gen3 interface for expansion and high-bandwidth data transfer capabilities

Applications

• Industrial automation and control systems requiring real-time processing
• Medical imaging devices needing high-performance data acquisition
• Automotive infotainment and driver assistance system prototypes
• Telecommunications infrastructure equipment development

Procurement Notes

Verify compatibility with specific Zynq UltraScale+ MPSoC variants (XCZU3EG/CG) before integration. Confirm pinout alignment with host system requirements. Ensure thermal management solutions are adequate for the target operating environment. Check for latest firmware updates from Trenz Electronic to support current software stacks.

Selection Notes

Select this carrier when utilizing the XCZU3EG or XCZU3CG Zynq UltraScale+ MPSoC. It is suitable for applications requiring multiple high-speed I/Os without custom PCB design. Consider alternative modules if different package sizes or pin counts are required by the application constraints.

Part Context

This component belongs to the Trenz Electronic ZynqUltraScale+ MPSoC module series. It serves as a hardware platform to accelerate development cycles for designs based on Xilinx's heterogeneous computing architecture, combining programmable logic with processing systems.