TE0745-02-30-2I

Overview

The TE0745-02-30-2I is a System-on-Module (SoM) manufactured by Trenz Electronic, designed for embedded applications requiring high performance and reliability. This module integrates an AMD Zynq-7000 SoC, specifically the XC7Z030-1FBG676I chip, which combines dual-core ARM Cortex-A9 processors with programmable logic fabric. It features 1 GB of DDR3L SDRAM for system memory and includes 64 MB of flash storage for persistent data retention. The module operates within a commercial temperature range of -40°C to +85°C and adheres to RoHS standards. Its compact form factor measures 52 mm by 76 mm, facilitating integration into space-constrained designs while providing essential interfaces such as I2C, JTAG, QSPI, USB 2.0, and Ethernet connectivity.

Feature Summary

• Integrates AMD Zynq-7000 SoC with dual-core ARM Cortex-A9 processor and FPGA fabric
• Includes 1 GB DDR3L SDRAM and 64 MB flash memory on board
• Supports standard industrial communication interfaces including Ethernet, USB 2.0, and JTAG
• Designed for robust operation in demanding environments with wide temperature tolerance

Applications

• Industrial automation and control systems
• Embedded data acquisition and processing units
• High-accuracy measurement instrumentation
• Automotive infotainment and telematics modules
• Custom embedded digital signal processing solutions

Procurement Notes

Verify component availability through authorized distributors or direct manufacturer channels, as supply status may vary. Confirm that the specific suffix indicates the correct silicon grade and package variant required for your design. Ensure compliance with RoHS directives if deploying in regulated markets. Cross-reference the Mouser part number 287-te0745-02-30-2i for accurate identification during sourcing. Request updated datasheets and ECAD models prior to finalizing procurement to ensure compatibility with existing infrastructure.

Selection Notes

Select this module when a balance between processing power and cost-efficiency is needed for Zynq-7000 based projects. It is suitable for designs requiring moderate FPGA resources alongside powerful ARM processing capabilities. Consider the 52x76mm footprint against available board real estate. Verify interface requirements match the available pins on the module edge connector. Evaluate thermal management needs given the operating temperature range and potential heat dissipation from the SoC under load.

Part Context

Trenz Electronic specializes in developing high-speed data acquisition and embedded DSP systems based on FPGA and CPU architectures. The company provides comprehensive engineering support, including design-in assistance and turnkey solutions. Their product portfolio includes various SoM products compatible with widespread form factors, catering to industries such as automotive and industrial automation. All modules are developed and manufactured in Germany, ensuring quality control and adherence to strict engineering standards throughout the production lifecycle.

Replacement Considerations

Publicly confirmed substitutes include the TE0745-03-71I31-A, which utilizes the AMD Zynq 7030-1I processor. Another alternative is the TE0745-02-72I11-A, featuring the Xilinx Zynq XC7Z030-2FBG676I. Both options maintain similar physical dimensions and core functionality but may differ in silicon speed grades or specific interface configurations. Review datasheets carefully to ensure pinout compatibility and software migration paths before transitioning to these replacement parts.