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The TE0745-02-30-2IA is a System-on-Module (SoM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq-7000 SoC, specifically the XC7Z030-1FBG676I chip, which combines dual ARM Cortex-A9 processors with Xilinx Kintex-7 FPGA fabric. The module includes 1 GByte of DDR3L SDRAM and 64 MB of flash memory. It operates within an industrial temperature range of -40°C to +85°C and features a compact form factor measuring 52 mm x 76 mm.
Verify component availability as this specific model may be subject to discontinuation or limited supply status. Confirm that the ordering suffix corresponds to the exact silicon grade and package variant required for your design. Check for any Product Change Notifications (PCN) that might affect pin compatibility or material composition before finalizing procurement plans.
Select this module when a combined FPGA and processor solution is needed in a small footprint. Ensure the design supports the 52 mm x 76 mm form factor. Verify that the required peripheral interfaces, such as Ethernet and USB 2.0, are adequately routed on the carrier board. Consider thermal management solutions suitable for the industrial temperature range if high computational loads are expected.
This module belongs to the TE0745 series of System-on-Modules from Trenz Electronic. The series is characterized by its use of AMD/Xilinx Zynq-7000 technology, offering a balance of processing power and programmability. These modules are part of Trenz Electronic's portfolio of German-engineered embedded solutions, often paired with compatible baseboards and development tools for rapid prototyping.
Publicly confirmed direct substitutes are not available in the provided documentation. The related TE0745-03-71I31-A uses the same XC7Z030-1FBG676I processor but may differ in revision or minor specifications. Designers should consult official replacement guides or contact the manufacturer for validated alternative components.