TE0745-02-35-1C

TE0745-02-35-1C

  • Description:IC MODULE CORTEX-A9 1GB 32MB
  • Series:TE0745

SKU:c0b9da816545 Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE CORTEX-A9 1GB 32MB
  • Series:TE0745
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM® Cortex®-A9
  • Co-Processor:Zynq-7000 (Z-7035)
  • Speed:-
  • Flash Size:32MB
  • RAM Size:1GB
  • Connector Type:Samtec UFPS
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:0°C ~ 70°C

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TE0745-02-35-1C

Overview

The TE0745-02-35-1C is a System-on-Module (SoM) manufactured by Trenz Electronic GmbH, designed for programmable logic applications. It integrates the AMD Zynq XC7Z035-1CLG484I processor, featuring an ARM Cortex-A9 dual-core application processor and Xilinx Artix-7 FPGA fabric. The module includes 1 GByte of DDR3L SDRAM and 64 MByte of Flash memory. Operating within an industrial temperature range of -40°C to +85°C, it utilizes a 5.2 x 7.6 cm form factor with standard board-to-board connectors.

Feature Summary

  • Integrates AMD Zynq SoC combining ARM Cortex-A9 processors with Artix-7 FPGA logic
  • Includes onboard 1 GByte DDR3L SDRAM and 64 MByte non-volatile Flash storage
  • Supports industrial-grade operation across extended temperature ranges
  • Provides high-density I/O via rugged board-to-board stacking connectors

Applications

  • Industrial automation and control systems requiring embedded processing
  • High-performance data acquisition and signal processing modules
  • Medical imaging equipment and diagnostic devices
  • Automotive infotainment and instrument cluster interfaces
  • Telecommunications infrastructure and baseband processing units

Procurement Notes

Verify component availability status as some TE0745 variants have reached end-of-life. Confirm specific suffix requirements for temperature grade and package type against project specifications. Ensure compatibility with carrier boards utilizing matching connector pitches. Review latest product change notifications for any material or design updates affecting long-term supply stability.

Selection Notes

Select this module when a balance between FPGA flexibility and embedded processing power is required in a compact footprint. The XC7Z035 offers sufficient logic resources for moderate complexity designs while providing dual-core ARM processing for real-time control tasks. Consider thermal management solutions if operating at maximum load within the industrial temperature envelope.

Part Context

Trenz Electronic specializes in modular computing solutions based on Xilinx and AMD FPGAs and SoCs. The TE0745 series represents their standard-sized System-on-Modules, widely adopted in industrial and automotive sectors. These modules simplify hardware design by integrating complex power sequencing, memory interfaces, and boot configurations into a single, reliable component.

Replacement Considerations

Check for direct substitutes within the TE0745 family such as the TE0745-03 variant which may offer updated processor generations. Verify pinout compatibility with existing carrier boards before switching. Consult manufacturer documentation for any functional differences between silicon revisions or memory configurations.

TE0745-02-35-1CTE0745-02-35-1C

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