TE0745-02-35-1CA

Overview

The TE0745-02-35-1CA is a System-on-Module (SoM) manufactured by Trenz Electronic GmbH. It integrates an AMD Zynq-7000 SoC, specifically the XC7Z030-1CLG400I processor, featuring dual ARM Cortex-A9 cores and programmable logic fabric. The module includes 1 GByte of DDR3L SDRAM for system memory. Designed for industrial applications, it operates within a temperature range of -40°C to +85°C. The form factor measures 52 mm x 76 mm, providing a compact solution for embedded computing tasks requiring both processing power and reconfigurable hardware capabilities.

Feature Summary

• Integrates AMD Zynq-7000 SoC with dual-core ARM Cortex-A9 processor and FPGA fabric
• Includes 1 GByte DDR3L SDRAM for high-speed data handling
• Industrial-grade operating temperature range from -40°C to +85°C
• Compact 52 mm x 76 mm System-on-Module footprint

Applications

• Industrial automation and control systems
• Embedded data acquisition and processing
• Medical imaging devices
• Telecommunications infrastructure equipment

Procurement Notes

Verify the specific suffix '35-1CA' against official Trenz Electronic documentation to confirm pinout compatibility and revision status. Ensure that the required interface signals match the carrier board design. Check for any Product Change Notifications (PCNs) related to this part number to confirm component availability and long-term supply stability before finalizing procurement plans.

Selection Notes

Select this module when a combination of ARM processing and FPGA flexibility is required in a small form factor. The XC7Z030-1CLG400I offers sufficient logic resources for moderate complexity designs. Consider the 1 GByte DDR3L limit for memory-intensive applications. Verify thermal management requirements given the industrial temperature rating and potential heat dissipation needs on custom carrier boards.

Part Context

This part belongs to the TE0745 series of System-on-Modules from Trenz Electronic. The series is designed around Xilinx/AMD Zynq-7000 devices, offering a balance between processing performance and programmable logic. These modules are intended for integration into custom carrier boards, allowing developers to leverage standard interfaces while focusing on application-specific logic and software development.

Replacement Considerations

Direct replacements may include other TE0745 variants with different Zynq-7000 chips (e.g., XC7Z020 or XC7Z045) if resource requirements differ. Cross-series migration to TE0720 or TE0727 requires careful evaluation of pin compatibility and memory architecture changes. Always consult official substitution guides as package differences can impact mechanical and electrical integration.