TE0745-02-45-2I

TE0745-02-45-2I

  • Description:IC MODULE CORTEX-A9 1GB 32MB
  • Series:TE0745

SKU:64c8df625cc4 Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE CORTEX-A9 1GB 32MB
  • Series:TE0745
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM® Cortex®-A9
  • Co-Processor:Zynq-7000 (Z-7045)
  • Speed:-
  • Flash Size:32MB
  • RAM Size:1GB
  • Connector Type:Samtec UFPS
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0745-02-45-2I

Overview

The TE0745-02-45-2I is a System-on-Module (SoM) manufactured by Trenz Electronic, designed for embedded applications requiring high processing performance. It integrates an AMD Zynq-7000 series processor, specifically the XC7Z030 variant, which combines dual-core ARM Cortex-A9 processors with programmable logic fabric. The module includes 1 GByte of DDR3L SDRAM for system memory and 64 MB of flash storage. Operating within an industrial temperature range of -40°C to +85°C, it supports interfaces including Ethernet, I2C, JTAG, QSPI, and USB 2.0, housed in a compact 5.2 x 7.6 cm form factor.

Feature Summary

  • Integrates Xilinx Zynq XC7Z030 SoC with ARM Cortex-A9 and FPGA fabric
  • Includes 1 GByte DDR3L SDRAM and 64 MB flash memory on-module
  • Supports industrial operating temperatures from -40°C to +85°C
  • Provides multiple interface options including Ethernet, USB 2.0, and JTAG

Applications

  • Industrial automation and control systems
  • Embedded data acquisition and signal processing
  • High-precision measurement equipment
  • Automotive infotainment and telematics units

Procurement Notes

Verify current availability status as this specific model may be subject to discontinuation or limited supply. Confirm compatibility with carrier boards using the TE0745 series specifications. Ensure that the required interface signals are correctly mapped on the host design. Check for any product change notifications related to component substitutions or firmware updates before finalizing procurement plans.

Selection Notes

Select this module when a combined CPU and FPGA solution is required within a small footprint. The XC7Z030 provides sufficient logic resources for moderate complexity designs. Consider the TE0745-03 series if newer processor variants or updated pinouts are preferred. Verify thermal management requirements given the industrial temperature range and power dissipation characteristics of the Zynq-7000 architecture.

Part Context

This part belongs to the TE0745 family of System-on-Modules from Trenz Electronic, which are based on Xilinx Zynq-7000 technology. These modules are designed to accelerate development cycles by providing pre-validated hardware platforms. The TE0745 series typically offers various processor options and memory configurations to suit different performance and cost constraints in embedded engineering projects.

Replacement Considerations

The TE0745-02-72I11-A is a documented substitute within the same series, featuring the same XC7Z030 processor but potentially different revision details. Users should verify mechanical and electrical compatibility with existing carrier boards. Note that the TE0745-03-71I31-A represents a newer generation with the Zynq 7030-1i processor, which may require design adjustments.

TE0745-02-45-2ITE0745-02-45-2I

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