TE0745-02-71I31-A

TE0745-02-71I31-A

  • Description:MOD SOM DDR3L 1GB
  • Series:TE0745

SKU:eb05a422078c Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:MOD SOM DDR3L 1GB
  • Series:TE0745
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM Cortex-A9
  • Co-Processor:Zynq-7000 (Z-7030)
  • Speed:-
  • Flash Size:64MB
  • RAM Size:1GB
  • Connector Type:Board-to-Board (BTB) Socket - 160
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:-40°C ~ 85°C

Download product information

TE0745-02-71I31-A

Overview

The Trenz Electronic TE0745-02-71I31-A is a System on Module integrating an AMD Zynq XC7Z030-1FBG676I processor. It features dual-core ARM Cortex-A9 MPCore processors and includes 1 GByte of DDR3L SDRAM alongside 64 MByte Quad SPI Flash memory. The module provides extensive I/O connectivity through three high-speed stacking strips, supporting up to 250 FPGA PL I/Os with differential pairs. It incorporates essential peripherals such as a Gigabit Ethernet PHY, USB ULPI transceiver, temperature-compensated RTC, and programmable clock generators.

Feature Summary

  • Integrates Xilinx Zynq SoC with dual-core ARM Cortex-A9 processing system
  • Features rugged Board-to-Board connectors for high-speed signal integrity
  • Includes on-board power management with high-efficiency DC-DC converters
  • Supports bit-stream encryption via eFUSE and AES mechanisms

Applications

  • Industrial automation controllers requiring robust processing
  • Medical imaging systems needing reliable data acquisition
  • Aerospace and defense avionics platforms
  • Test and measurement instrumentation equipment

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current configuration matrix to ensure compatibility with required memory densities and interface options. Confirm that the procurement documentation references the correct hardware revision level. Ensure all technical specifications align with the intended environmental operating conditions. Request detailed assembly drawings prior to final integration planning.

Selection Notes

Select this module when a compact form factor is required alongside significant FPGA logic resources. The integrated DDR3L and QSPI Flash reduce external component count compared to discrete solutions. Consider the available MGT lanes for high-speed serial applications. Evaluate the CPLD-based system management capabilities for complex boot sequence requirements.

Part Context

This module belongs to the TE0745 family designed by Trenz Electronic. It utilizes the Xilinx Zynq-7000 series architecture. The product line focuses on providing industrial-grade reliability with extended temperature ranges. It serves as a core computing element for custom carrier boards in embedded systems.

Replacement Considerations

Consult the official Trenz Electronic substitution guide for verified compatible variants within the TE0745 series. Cross-reference pinouts and voltage levels when considering alternative modules from other manufacturers.

TE0745-02-71I31-ATE0745-02-71I31-A

Click on the inquiry