TE0745-02-72I11-A

TE0745-02-72I11-A

  • Description:SOM 1GB DDR3 XC7Z030-2FBG676I
  • Series:TE0745

SKU:15b8400784ac Category: Brand:

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Product Detailed Parameters

  • Description:SOM 1GB DDR3 XC7Z030-2FBG676I
  • Series:TE0745
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Xilinx Zynq XC7Z030-2FBG676I
  • Co-Processor:-
  • Speed:-
  • Flash Size:64MB
  • RAM Size:1GB
  • Connector Type:Samtec ST5
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0745-02-72I11-A

Overview

The Trenz Electronic TE0745-02-72I11-A is a System on Module integrating an AMD Zynq XC7Z030 SoC with dual-core ARM Cortex-A9 processors. It features 1 GByte of DDR3L SDRAM and 64 MByte of Quad SPI Flash memory. The module provides extensive I/O connectivity via three high-speed Board-to-Board connectors, supporting up to 250 FPGA Programmable Logic I/Os. It includes integrated peripherals such as a Gigabit Ethernet PHY, USB ULPI transceiver, Real-Time Clock, and programmable clock generators.

Feature Summary

  • Integrates Xilinx Zynq XC7Z family SoC with dual-core ARM Cortex-A9 MPCore
  • Features rugged Board-to-Board connectors for high-speed stacking strip integration
  • Includes on-board system management CPLD for centralized control logic
  • Supports eFUSE bit-stream encryption and AES security features

Applications

  • Industrial automation controllers requiring robust processing
  • Medical imaging systems needing secure data handling
  • Aerospace and defense avionics platforms
  • Test and measurement instrumentation equipment

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current configuration matrix to ensure correct processor grade and memory density. Confirm RoHS compliance status and environmental operating range requirements prior to finalizing procurement orders. Request the latest Technical Reference Manual revision to validate pin assignments and power sequencing details.

Selection Notes

Select this module when a compact form factor is required alongside significant Programmable Logic resources. Ensure the baseboard design accommodates the specific voltage levels and power distribution dependencies outlined in the datasheet. Consider the available GTX transceiver lanes if high-speed serial communication interfaces are necessary for the application.

Part Context

This component belongs to the TE0745 modular system series designed by Trenz Electronic. These modules are engineered to simplify the integration of Xilinx Zynq SoCs into custom carrier boards. The series offers various configurations to meet different performance and interface requirements while maintaining a standardized mechanical footprint.

Replacement Considerations

Consult the official Trenz Electronic documentation for verified alternative part numbers within the TE0745 family that may offer different processor variants or memory configurations. Cross-reference specifications carefully to ensure compatibility with existing baseboard designs and software environments.

TE0745-02-72I11-ATE0745-02-72I11-A

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