TE0745-02-72I31-A

Overview

The Trenz Electronic TE0745-02-72I31-A is a System-on-Module integrating the AMD Xilinx Zynq XC7Z030-1FBG676I SoC. It features a dual-core ARM Cortex-A9 processor and an FPGA fabric with 250 programmable I/Os. The module includes 1 GByte of DDR3L SDRAM, 64 MByte Quad SPI Flash memory, and a 1 Gigabit Ethernet PHY. It supports USB 2.0 OTG via ULPI and provides multiple high-speed serial transceivers.

Feature Summary

• Integrates AMD Xilinx Zynq XC7Z030 SoC with dual-core ARM Cortex-A9 MPCore
• Includes 1 GByte DDR3L SDRAM and 64 MByte QSPI Flash for configuration
• Features rugged Board-to-Board connectors for industrial shock and vibration resistance
• Supports eFUSE and AES bit-stream encryption for secure boot

Applications

• Industrial automation and control systems
• High-precision measurement equipment
• Embedded digital signal processing applications
• Prototyping for automotive and aerospace sectors

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current product portfolio to confirm availability status. This module variant may be subject to discontinuation notices or supply restrictions. Confirm that the required thermal management solutions, such as heat spreaders, are compatible with the selected module revision and operating environment.

Selection Notes

Select this module when a compact form factor is required alongside significant processing power from the Zynq architecture. Ensure the baseboard design accommodates the 3x160-pin high-speed stacking connectors. Verify that the on-board peripherals, including the Ethernet PHY and USB ULPI interface, meet the system connectivity requirements without additional external components.

Part Context

This module belongs to the TE0745 family, designed by Trenz Electronic GmbH for embedded applications. The company specializes in FPGA and SoC modules based on AMD, Altera, and Microchip technologies. The TE0745 series provides scalable solutions ranging from prototyping to serial production, often utilized in conjunction with carrier boards and development kits.

Replacement Considerations

Public documentation indicates that the TE0745-02-72I31-A has reached end-of-life status. Engineers should evaluate alternative modules within the TE0745 series or newer generations such as the TE0821 or TE0835 families. Any replacement must be verified for mechanical compatibility with existing carrier board footprints and electrical pin assignments.