TE0745-02-81C11-A

TE0745-02-81C11-A

  • Description:SOM MIT XILINX ZYNQ
  • Series:TE0745

SKU:3d62b2bd8d8d Category: Brand:

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Product Detailed Parameters

  • Description:SOM MIT XILINX ZYNQ
  • Series:TE0745
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM® Cortex®-A9
  • Co-Processor:Zynq-7000 (Z-7035)
  • Speed:-
  • Flash Size:32MB
  • RAM Size:1GB
  • Connector Type:Samtec ST5
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0745-02-81C11-A

Overview

The TE0745-02-81C11-A is a System-on-Module (SoM) manufactured by Trenz Electronic GmbH. It integrates an AMD Zynq-7000 SoC, specifically the XC7Z030-2FBG676I chip, featuring dual ARM Cortex-A9 processors and programmable logic fabric. The module includes 1 GByte of DDR3L SDRAM for system memory and 64 MB of flash storage. Designed for industrial environments, it operates within a temperature range of -40°C to +85°C and adheres to RoHS standards.

Feature Summary

  • Integrates AMD Zynq-7000 SoC with dual-core ARM Cortex-A9 processor and FPGA fabric
  • Includes 1 GByte DDR3L SDRAM and 64 MB flash memory on board
  • Supports standard interfaces including Ethernet, I2C, JTAG, QSPI, and USB 2.0
  • Rated for extended industrial operating temperatures from -40°C to +85°C

Applications

  • Industrial automation and control systems requiring embedded processing
  • High-speed data acquisition and measurement applications
  • Embedded digital signal processing in harsh environments
  • Prototyping and development of custom embedded solutions

Procurement Notes

Verify current availability status as this specific model may be subject to discontinuation or limited supply notifications. Confirm compatibility with baseboards designed for the TE0745 form factor. Ensure that the required interface signals are correctly mapped in your carrier design. Check for any Product Change Notifications (PCN) related to component substitutions or manufacturing updates before finalizing procurement plans.

Selection Notes

Select this module when a compact solution combining ARM processing power with FPGA flexibility is required. It is suitable for designs needing robust industrial temperature ratings. Consider the TE0745 series if standardized dimensions and pinouts are preferred for rapid integration. Evaluate thermal management requirements given the integrated memory and processor density on the small footprint.

Part Context

Trenz Electronic GmbH specializes in high-performance FPGA and SoC modules for industrial and automotive applications. The TE0745 series represents their modular approach to Zynq-based computing, offering standardized footprints to simplify carrier board design. These modules are developed and manufactured in Germany, providing engineering support and turnkey design services for complex embedded projects.

Replacement Considerations

Check for official end-of-life notifications or product change notices from Trenz Electronic. Potential alternatives within the same family include variants with different speed grades or memory configurations, such as the TE0745-03-71I31-A. Verify mechanical and electrical compatibility with existing carrier boards before switching to substitute models.

TE0745-02-81C11-ATE0745-02-81C11-A

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