TE0745-02-81C11-AK

Overview

The TE0745-02-81C11-AK is a System-on-Module (SoM) manufactured by Trenz Electronic GmbH, designed for embedded programmable logic applications. It integrates the AMD Zynq XC7Z030-2FBG676I processor, featuring an ARM Cortex-A9 dual-core architecture alongside programmable FPGA fabric. The module includes 1 GByte of DDR3L SDRAM and 64 MB of flash memory. It operates within a commercial temperature range and supports interfaces including Ethernet, I2C, JTAG, QSPI, and USB 2.0.

Feature Summary

• Integrates AMD Zynq XC7Z030 SoC with dual ARM Cortex-A9 processors and FPGA fabric
• Includes 1 GByte DDR3L SDRAM and 64 MB flash memory on board
• Supports multiple high-speed interfaces such as Ethernet, USB 2.0, and QSPI
• Compact form factor measuring 5.2 x 7.6 cm for space-constrained designs

Applications

• Industrial automation and control systems
• Embedded data acquisition and processing
• High-accuracy measurement instrumentation
• Customizable embedded digital signal processing

Procurement Notes

Verify component availability status prior to procurement, as this specific model may be subject to discontinuation or limited supply constraints. Confirm that the required interface configurations and memory specifications align with the target application requirements. Ensure compatibility with existing baseboard designs utilizing standard form factors supported by Trenz Electronic modules.

Selection Notes

Select this module when a combined CPU and FPGA solution is required in a compact footprint. The Zynq XC7Z030 provides sufficient processing power for moderate complexity tasks. Consider thermal management solutions if operating at the upper limits of the commercial temperature range. Verify that the integrated memory capacities meet the system's real-time processing and storage needs.

Part Context

Trenz Electronic GmbH specializes in FPGA and SoC-based development services and modules. This product belongs to their modular system portfolio, aimed at providing turnkey solutions for industrial and automotive applications. The company manufactures these modules in Germany, offering engineering support for design-in and prototyping phases across various embedded computing sectors.

Replacement Considerations

The related model TE0745-02-72I11-A shares similar specifications but differs in grade. Check official documentation for pin-to-pin compatibility and functional equivalence before substitution. Ensure that any replacement maintains the same processor series and memory configuration to avoid redesigning the carrier board.