TE0745-02-81C31-AK

TE0745-02-81C31-AK

  • Description:MOD SOM DDR3L 1GB
  • Series:TE0745

SKU:46b10faad9a4 Category: Brand:

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Product Detailed Parameters

  • Description:MOD SOM DDR3L 1GB
  • Series:TE0745
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM Cortex-A9
  • Co-Processor:Zynq-7000 (Z-7035)
  • Speed:-
  • Flash Size:64MB
  • RAM Size:1GB
  • Connector Type:Board-to-Board (BTB) Socket - 480
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0745-02-81C31-AK

Overview

The TE0745-02-81C31-AK is a System-on-Module manufactured by Trenz Electronic, integrating an AMD Zynq-7000 SoC. This specific variant utilizes the XC7Z020-2CLG400C processor, featuring dual ARM Cortex-A9 cores and programmable logic fabric. The module includes 1 GByte of DDR3L SDRAM for system memory and 64 MBit of Flash storage for configuration data. It operates within an industrial temperature range of -40°C to +85°C and adheres to RoHS standards.

Feature Summary

  • Integrates AMD Zynq-7000 SoC with dual-core ARM Cortex-A9 processing system
  • Includes onboard 1 GByte DDR3L SDRAM and 64 MBit Flash memory
  • Designed for industrial environments with extended temperature support
  • Provides standard interfaces including Ethernet, I2C, JTAG, QSPI, and USB 2.0

Applications

  • Industrial automation and control systems
  • Embedded data acquisition and signal processing
  • Medical device embedded controllers
  • Automotive infotainment and instrumentation
  • High-precision measurement equipment

Procurement Notes

Verify current availability status as some TE0745 series modules may be subject to discontinuation notices or limited supply conditions. Confirm that the specific suffix indicates the correct processor speed grade and package type required for your design. Ensure compatibility with existing carrier boards designed for the 5.2 x 7.6 cm form factor. Check for any recent Product Change Notifications regarding component substitutions or manufacturing updates.

Selection Notes

Select this module when a balance between processing power and pin count is required, utilizing the CLG400 package. Compare against the TE0745-03 series if higher performance (XC7Z030) is needed. Consider the TE0745-02-72I11-A if an FBG676 package is preferred for higher I/O density. Ensure thermal management solutions are adequate for the target application's power dissipation profile within the specified operating temperature range.

Part Context

This module belongs to the TE0745 family of System-on-Modules from Trenz Electronic, which are based on AMD Xilinx Zynq-7000 devices. The family offers various configurations differing in processor speed grades, packages, and memory capacities. These modules are designed to accelerate development cycles for embedded applications requiring both programmable logic and hard processor systems.

FAQ

What is the difference between the TE0745-02-81C31-AK and the TE0745-03-71I31-A?

The primary difference lies in the integrated processor. The TE0745-02-81C31-AK uses the XC7Z020-2CLG400C, while the TE0745-03-71I31-A uses the higher-performance XC7Z030-1FBG676I. They share similar memory configurations but differ in logic resources and I/O capabilities.

Does this module support industrial temperature ranges?

Yes, the TE0745-02-81C31-AK is rated for an operating temperature range of -40°C to +85°C, making it suitable for industrial and harsh environment applications.

What interfaces are available on this SOM?

The module provides access to multiple interfaces including Ethernet, I2C, JTAG, QSPI, and USB 2.0, allowing for versatile connectivity options in embedded designs.

TE0745-02-81C31-AKTE0745-02-81C31-AK

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