TE0745-02-91C11-A

Overview

The Trenz Electronic TE0745-02-91C11-A is a rugged System-on-Module integrating a Xilinx Zynq SoC, 1 GB DDR3L SDRAM, and QSPI Flash. It features dual-core ARM Cortex-A9 processors, up to eight GTX transceiver lanes, and a Gigabit Ethernet PHY. The module utilizes three high-speed stacking connectors for extensive I/O access, including LVDS pairs and MGT lanes. Onboard peripherals include a programmable clock generator, temperature-compensated RTC, USB ULPI PHY, and system management CPLD.

Feature Summary

• Industrial-grade Xilinx Zynq SoC with dual-core ARM Cortex-A9 MPCore
• Rugged design with shock and vibration resistance for harsh environments
• On-board security features including eFUSE and AES bit-stream encryption
• Integrated system management via dedicated CPLD and power sequencing

Applications

• Industrial automation and control systems
• Aerospace and defense embedded platforms
• Medical imaging equipment
• Automotive infotainment and telematics

Procurement Notes

Verify the specific Zynq variant (XC7Z-030, -035, or -045) required for the application, as performance varies by model. Confirm that the base board provides the necessary VBAT_IN supply for the RTC backup battery. Ensure the host carrier supports the 12V input voltage and matches the pinout of the three 160-pin B2B connectors for proper signal integrity and power distribution.

Selection Notes

Select this module when high reliability in extreme temperatures is required. The XC7Z-030 variant offers four GTX lanes, while higher variants provide eight. Consider the available PL I/O count and LVDS pair requirements against the three connector banks. Verify compatibility with existing Linux BSPs if software development is planned, noting the initial delivery state leaves flash unprogrammed.

Part Context

This module belongs to the TE0745 family from Trenz Electronic, designed for compact, high-performance embedded applications. It serves as a drop-in replacement for other Zynq-based modules requiring similar form factors but with enhanced ruggedness. The TE0745 series emphasizes industrial compliance and long-term availability for critical infrastructure projects.

Replacement Considerations

Direct replacements must match the Zynq SoC family and physical footprint. Verify that alternative modules support the same number of DDR3 banks and QSPI interfaces. Check if the competitor's solution offers comparable thermal management and vibration resistance ratings suitable for the target deployment environment.

FAQ

How is the boot source selected on the TE0745?

Boot mode is configured via the BOOTMODE and BOOTMODE_1 signals connected to MIO4 and the System Controller CPLD, respectively. Supported modes include JTAG, QSPI, and SD Card.

What is the maximum speed of the onboard DDR3L SDRAM?

The DDR3L SDRAM operates at a maximum speed of 1600 Mb/s, utilizing two 512 Mbit ICs for a total capacity of 1 GB.

Can the FPGA configuration be encrypted?

Yes, the module supports eFUSE bit-stream encryption and AES bit-stream encryption for secure FPGA configuration storage.