TE0745-02-91C31-A

Overview

The Trenz Electronic TE0745-02-91C31-A is a System-on-Module integrating a Xilinx Zynq XC7Z SoC, 1 GB DDR3L SDRAM, and 64 MByte Quad SPI Flash. It features dual-core ARM Cortex-A9 processors, up to eight GTX transceiver lanes, and a Gigabit Ethernet PHY. The module utilizes three 160-pin high-speed stacking connectors for Board-to-Board interfacing, supporting industrial, commercial, and extended temperature grades with on-board switch-mode power supplies.

Feature Summary

• Integrates Xilinx Zynq XC7Z family SoC with dual-core ARM Cortex-A9 MPCore
• Includes 1 GB DDR3L SDRAM and 64 MByte QSPI Flash memory
• Features rugged Board-to-Board connectors with extensive PL I/O support
• On-board peripherals include Gigabit Ethernet PHY, USB ULPI PHY, and RTC

Applications

• Industrial automation controllers requiring robust processing
• Medical imaging systems needing high-speed data acquisition
• Aerospace and defense avionics platforms
• Test and measurement equipment interfaces

Procurement Notes

Verify the specific Zynq SoC variant (XC7Z-030, -035, or -045) required for your application, as performance varies by model. Confirm that the base board provides the necessary VBAT_IN signal for the Real-Time Clock backup. Ensure mechanical clearance accommodates the module dimensions and connector heights. Check for any specific assembly options requested during ordering.

Selection Notes

Select this module when a compact form factor with integrated memory and connectivity is required. The TE0745 supports multiple boot modes including QSPI and SD Card. Consider the GTX lane availability; the XC7Z-030 variant offers four lanes while others provide eight. Verify that the available PL I/Os meet the interface requirements of the target system design.

Part Context

This module belongs to the Trenz Electronic 7 Series FPGA evaluation and production line. It is designed to accelerate development for Xilinx Zynq All Programmable SoCs. The TE0745 series provides a standardized hardware platform compatible with various carrier boards, simplifying the transition from prototyping to mass production for embedded applications.

Replacement Considerations

Publicly confirmed substitutes within the same product family include variants with different Zynq chip densities such as the TE0745-01 or TE0745-03. These share identical mechanical footprints and peripheral configurations but differ in processing power and transceiver lane counts. Verify compatibility with existing carrier board designs before substitution.