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The Trenz Electronic TE0745-02-92I31-A is a System-on-Module integrating an AMD Zynq XC7Z030-1FBG676I processor with dual-core ARM Cortex-A9 MPCore. It features 1 GByte of DDR3L SDRAM and 64 MByte Quad SPI Flash memory. The module provides 250 FPGA PL I/Os, four GTX transceiver lanes, and a Gigabit Ethernet PHY. It operates within an industrial temperature range of -40°C to +85°C and utilizes three high-speed stacking connectors for board-to-board interfacing.
Verify the specific ordering suffix against the manufacturer's current product matrix to confirm component revisions and availability status. Confirm that the required boot mode configuration matches the default hardware settings documented in the technical reference manual. Ensure baseboard designs accommodate the specified power supply requirements and connector pinouts.
Select this module when a Zynq-7000 series SoC with integrated hard processor system is required alongside significant programmable logic resources. The TE0745 form factor supports various Zynq variants; verify that the XC7Z030 device meets the specific performance and I/O count requirements for the target application.
This module belongs to the TE0745 family of System-on-Modules manufactured by Trenz Electronic GmbH. These modules are designed for compact integration into carrier boards using standard stacking connectors. The family supports multiple Zynq processors, offering scalable performance for diverse embedded computing needs.
Consult the official Trenz Electronic discontinuation notifications for confirmed substitute part numbers. Verify compatibility with existing carrier board footprints and firmware configurations before transitioning to alternative modules.