TE0745-02-92I31-AK

Overview

The Trenz Electronic TE0745-02-92I31-AK is a System-on-Module integrating an AMD Xilinx Zynq XC7Z-030 SoC. It features dual-core ARM Cortex-A9 processors and programmable logic with 250 FPGA I/Os. The module includes 1 GByte of DDR3L SDRAM and 64 MByte of Quad SPI Flash memory for configuration. It provides four GTX transceiver lanes, a Gigabit Ethernet PHY, and USB 2.0 OTG support via rugged board-to-board stacking connectors.

Feature Summary

• Integrates AMD Xilinx Zynq XC7Z-030 SoC with dual-core ARM Cortex-A9 MPCore
• Features 1 GByte DDR3L SDRAM and 64 MByte QSPI Flash memory
• Includes on-board Gigabit Ethernet PHY and USB 2.0 ULPI transceiver
• Provides rugged board-to-board stacking connectors for high-speed I/O

Applications

• Industrial automation and control systems
• Medical imaging devices requiring high-performance processing
• Telecommunications infrastructure equipment
• Test and measurement instrumentation

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current product portfolio to confirm availability and revision status. Ensure compatibility with baseboard designs regarding power supply requirements and mechanical dimensions. Confirm that the selected variant meets the required environmental operating conditions for the intended application environment.

Selection Notes

Select this module when a compact form factor is required alongside significant processing power from the Zynq architecture. Consider the available GTX lanes and GPIO count for interface requirements. Evaluate the on-board peripherals such as the Ethernet PHY and RTC if external components are to be minimized in the final design.

Part Context

This module belongs to the TE0745 family of System-on-Modules designed by Trenz Electronic. These modules are engineered to simplify the integration of Xilinx Zynq SoCs into custom carrier boards. The TE0745 series offers various configurations to accommodate different performance and connectivity needs within a standardized footprint.

Replacement Considerations

Consult the manufacturer's documentation for officially confirmed substitute parts or updated revisions. Verify pinout and electrical compatibility before transitioning to alternative modules to ensure seamless integration with existing hardware designs.