TE0745-02-92I31-F

Overview

The Trenz Electronic TE0745-02-92I31-F is a System-on-Module integrating an AMD Xilinx Zynq XC7Z-030 SoC. It features a dual-core ARM Cortex-A9 processor, 1 GByte DDR3L SDRAM, and 64 MByte Quad SPI Flash memory. The module provides 250 FPGA programmable logic I/Os, four GTX transceiver lanes, and a Gigabit Ethernet PHY. It utilizes three high-speed stacking connectors for board-to-board interfacing and includes on-board power management with switch-mode DC-DC converters.

Feature Summary

• Integrates AMD Xilinx Zynq XC7Z-030 SoC with dual-core ARM Cortex-A9 MPCore
• Includes 1 GByte DDR3L SDRAM and 64 MByte QSPI Flash for configuration
• Features rugged Board-to-Board connectors with 250 configurable PL I/Os
• Supports eFUSE bit-stream encryption and AES security features

Applications

• Industrial automation and control systems
• Embedded computing platforms requiring secure boot
• High-speed data acquisition applications
• Network infrastructure equipment

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current product matrix to confirm component availability and revision status. Confirm that the required thermal solution matches the module's physical dimensions and mounting requirements. Ensure baseboard designs comply with the documented power-on sequence and voltage rail specifications provided in the technical reference manual.

Selection Notes

Select this module when a compact form factor is required alongside significant processing capability. The integrated Gigabit Ethernet and USB OTG support simplify peripheral connectivity. Consider the available GTX lanes for high-speed serial communication needs. Verify that the baseboard can accommodate the specified B2B connector pitch and height constraints.

Part Context

This module belongs to the TE0745 family of System-on-Modules designed by Trenz Electronic. These modules are engineered for industrial and commercial environments, offering extended temperature ranges. The family supports various Zynq SoC variants, allowing designers to scale performance while maintaining consistent mechanical and electrical interfaces across different product generations.

Replacement Considerations

Consult the official Trenz Electronic discontinuation notices for legacy variants. Direct replacements within the same form factor may require firmware adaptation due to potential differences in pin mapping or peripheral integration between hardware revisions.