TE0745-03-81C31-A

TE0745-03-81C31-A

$915.18
  • Description:MOD SOM DDR3L 1GB
  • Series:Zynq® UltraScale+™

SKU:c0ab3a6167fb Category: Brand:

  
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Product Detailed Parameters

  • Description:MOD SOM DDR3L 1GB
  • Series:Zynq® UltraScale+™
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:FPGA
  • Core Processor:ARM® Cortex®-A9
  • Co-Processor:Xilinx Zynq 7035 SoC XC7Z035-1FBG676C
  • Speed:-
  • Flash Size:64MB
  • RAM Size:1GB
  • Connector Type:Board-to-Board (BTB) Socket
  • Size / Dimension:2.047" L x 2.992" W (52.00mm x 76.00mm)
  • Operating Temperature:0°C ~ 70°C

Download product information

TE0745-03-81C31-A

Overview

The TE0745-03-81C31-A is a System-on-Module by Trenz Electronic featuring the AMD Kintex-7 XC7Z035-1FBG676C FPGA. It integrates four MGT GTX lanes, dual HR IO banks (Banks 12 and 13), and dual HP IO banks (Banks 33 and 34). The module includes an onboard Lattice CPLD for system management, USB OTG connectivity, Ethernet support, and a real-time clock.

Feature Summary

  • Integrates AMD Kintex-7 FPGA with dedicated high-speed transceivers
  • Includes onboard Lattice CPLD for system controller functions
  • Provides comprehensive I/O expansion via multiple connector interfaces
  • Supports USB OTG and Ethernet communication protocols

Applications

  • High-performance embedded processing systems
  • Industrial automation and control applications
  • Communication infrastructure equipment
  • Test and measurement instrumentation

Procurement Notes

Verify the specific assembly variant suffix against official documentation to ensure correct component configuration. Confirm that the schematic revision matches the intended hardware design requirements. Cross-reference the manufacturer part number with authorized distributors to ensure authenticity and traceability of the module.

Selection Notes

Select this module when a compact form factor is required alongside significant FPGA logic resources and high-speed serial capabilities. Ensure carrier board designs accommodate the specified voltage ranges for HR and HP IO banks. Verify that the onboard power management and thermal dissipation meet the target application's environmental constraints.

Part Context

This module belongs to the TE0745 family designed for rapid prototyping and production integration. It utilizes the Zynq-7000 series architecture but focuses on the Kintex-7 FPGA fabric. The design emphasizes modularity, allowing developers to leverage pre-verified hardware configurations while maintaining flexibility for custom peripheral integration.

Replacement Considerations

Publicly confirmed substitutes are not available in the provided documentation. Replacement requires careful evaluation of pin compatibility, power consumption profiles, and firmware migration efforts. Consult Trenz Electronic directly for validated alternative modules within their portfolio.

TE0745-03-81C31-ATE0745-03-81C31-A
$915.18
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