TE0745-03-82I31-A

Overview

The TE0745-03-82I31-A is a System-on-Module by Trenz Electronic featuring the AMD Kintex-7 XC7Z035-2FBG676I FPGA. It integrates DDR3 SDRAM and provides extensive I/O via three B2B connectors. The module supports industrial operating temperatures ranging from -40°C to +85°C.

Feature Summary

• Integrates an AMD Kintex-7 SoC with dual ARM Cortex-A9 processors and programmable logic fabric.
• Includes onboard DDR3 SDRAM for system memory and configuration storage.
• Features dedicated high-speed transceiver lanes for serial communication interfaces.

Applications

• Industrial automation and control systems
• High-performance data acquisition hardware
• Embedded digital signal processing applications

Procurement Notes

Verify the specific assembly variant suffix against the official schematic documentation to ensure correct component revisions. Confirm that the required voltage ranges for all IO banks align with your carrier board design specifications before procurement.

Selection Notes

Select this module when a combination of high-speed serial transceivers and general-purpose I/O is required. Ensure the carrier board accommodates the specific pinout requirements of the three B2B connectors and supports the necessary power sequencing for the integrated DCDC converters.

Part Context

This part belongs to the TE0745 series of modular systems designed by Trenz Electronic. These modules are engineered for compact form factors, typically utilizing standard 5.2 x 7.6 cm dimensions to facilitate integration into custom embedded designs.

Replacement Considerations

Publicly confirmed direct substitutes are not available in the provided source material. Designers should evaluate other modules within the TE0745 family or consult manufacturer documentation for potential cross-references based on specific FPGA capacity and interface requirements.