TE0745-03-93E31-A

Overview

The TE0745-03-93E31-A is a System-on-Module (SoM) manufactured by Trenz Electronic, designed for industrial and embedded applications. It integrates an AMD Zynq-7000 SoC, specifically the XC7Z030-1FBG676I chip, featuring dual ARM Cortex-A9 processors. The module includes 1 GB of DDR3L SDRAM and 64 MB of flash memory. Operating within a temperature range of -40°C to +85°C, it utilizes a compact form factor measuring 52 mm by 76 mm.

Feature Summary

• Integrates AMD Zynq-7000 architecture with dual-core ARM Cortex-A9 processing units
• Includes onboard 1 GB DDR3L memory and 64 MB flash storage
• Designed for industrial environments with extended operating temperature support

Applications

• Embedded digital signal processing systems
• Industrial automation and control
• High-speed data acquisition interfaces
• Precision measurement instrumentation

Procurement Notes

Verify the specific suffix '93' against official Trenz Electronic documentation to confirm exact hardware revisions or pinout variations compared to standard variants like the 71 series. Ensure compatibility with required carrier boards, as this module requires a dedicated baseboard for full functionality. Confirm RoHS compliance status through current manufacturer datasheets before integration into regulated assemblies.

Selection Notes

Select this module when high-performance processing is required alongside FPGA programmability in a compact footprint. The Zynq-7030 provides sufficient logic resources for complex control tasks while maintaining low power consumption. Consider thermal management solutions, such as heat spreaders, if operating at the upper limits of the specified temperature range or under heavy computational loads.

Part Context

This component belongs to the TE0745 family of System-on-Modules from Trenz Electronic, which specializes in Xilinx-based embedded solutions. The company focuses on providing modular platforms that simplify the development of custom hardware designs. These modules are typically paired with carrier boards to create complete embedded systems for demanding industrial and automotive applications.

Replacement Considerations

Direct replacements may be limited due to the proprietary nature of the module form factor. Evaluate other Trenz Electronic TE0745 variants with different processor speeds or memory configurations. Cross-compatibility with carrier boards should be verified, as pinouts and power requirements may differ between specific model numbers within the same product family.