TE0782-02-045-2I

Overview

The TE0782-02-045-2I is a System-on-Module manufactured by Trenz Electronic, featuring the Xilinx Zynq Z-7010 SoC. This module integrates memory resources on both the Processing System and Programmable Logic sides to support high-performance embedded applications. It utilizes an 8.5 x 8.5 cm form factor and includes interfaces such as eMMC, Ethernet, JTAG, QSPI, and USB 2.0 for versatile connectivity.

Feature Summary

• Integrates Xilinx Zynq Z-7010 SoC for combined processing and programmable logic capabilities
• Provides memory resources on both Processing System and Programmable Logic domains
• Supports standard industrial interface protocols including Ethernet, eMMC, and USB 2.0

Applications

• Industrial automation control systems requiring FPGA flexibility
• High-performance embedded computing platforms
• Prototyping for complex digital signal processing designs

Procurement Notes

This component is listed as discontinued or end-of-life. Availability is restricted, and verification of current stock status with authorized distributors is essential before procurement planning. Confirm final lifecycle status and potential obsolescence risks through official manufacturer channels or certified suppliers.

Selection Notes

Select this module when a Zynq Z-7010 processor is required within an 8.5 x 8.5 cm footprint. Ensure design compatibility with the specified interface set including eMMC and Ethernet. Verify thermal management requirements due to the integrated memory configuration on both PS and PL sides.

Part Context

Trenz Electronic specializes in FPGA and SoC modules for industrial and research applications. The TE0782 series represents their high-performance modular solutions based on Xilinx architectures, designed to accelerate development cycles from prototype to production for embedded systems.

Replacement Considerations

As the part is discontinued, verify if newer series like TE0783 offer functional equivalents. Check for mechanical pin compatibility and software migration paths when considering alternative modules from the same manufacturer.