TE0782-02-82I33FA

TE0782-02-82I33FA

  • Description:IC MODULE CORTEX
  • Series:TE0782

SKU:afff1796656c Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE CORTEX
  • Series:TE0782
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM Cortex-A9
  • Co-Processor:Zynq-7000 (Z-7035)
  • Speed:-
  • Flash Size:32MB
  • RAM Size:1GB
  • Connector Type:Board-to-Board (BTB) Socket - 480
  • Size / Dimension:3.350" L x 3.350" W (85.00mm x 85.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0782-02-82I33FA

Overview

The Trenz Electronic TE0782-02-82I33FA is an industrial-grade System on Module based on the Xilinx Zynq-7000 SoC. It features a dual ARM Cortex-A9 MPCore processor and integrates 1 GByte of 32-bit wide DDR3L SDRAM alongside 32 MByte Quad SPI Flash memory. The module provides two Gigabit Ethernet PHYs, two high-speed USB 2.0 ULPI PHYs, and a 4 GByte eMMC storage option. Designed for rugged environments, it supports temperatures from -40°C to +85°C and includes a Lattice MachXO2 CPLD for system management.

Feature Summary

  • Industrial temperature range operation with rugged shock and vibration resistance
  • Integrated Lattice MachXO2 CPLD for centralized system control and monitoring
  • On-board programmable clock generator supporting GTX transceiver requirements
  • Dual MAC-address EEPROMs providing globally unique node addresses

Applications

  • High-performance embedded digital signal processing systems
  • Industrial automation and process control applications
  • Rugged data acquisition and measurement instrumentation
  • Automotive and high-end embedded computing platforms

Procurement Notes

Verify the specific SoC variant (XC7Z035, XC7Z045, or XC7Z100) required for your design, as the base model supports multiple options. Confirm that the manufacturing revision matches the TRM v.33 documentation. Ensure carrier board designs account for the 8.5 x 8.5 cm form factor and the three 160-pin stacking strip connectors. Check for any optional assembly configurations requested during ordering.

Selection Notes

Select this module when a compact, industrial-rated solution combining FPGA logic with ARM processing is needed. It is suitable for designs requiring significant I/O density via the stacking strips and high-speed serial connectivity through the GTX lanes. Consider the integrated peripherals like eMMC and QSPI if external storage footprint must be minimized. Evaluate the thermal performance requirements against the specified industrial operating range.

Part Context

This module belongs to the Trenz Electronic TE0782 series, which utilizes the Xilinx Zynq-7000 architecture. It is part of their portfolio of System on Modules designed for demanding industrial and automotive applications. The series emphasizes cost-performance ratios while maintaining robust signal integrity through evenly distributed supply pins and specialized power management components.

Replacement Considerations

Direct public substitutes are not explicitly listed in the provided documentation. Designers should evaluate other Trenz Electronic modules within the TE0782 family or the broader TE07xx series if different SoC densities or peripheral configurations are required. Carrier board compatibility must be verified when considering alternative modules due to potential pinout variations.

TE0782-02-82I33FATE0782-02-82I33FA

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