TE0782-02-82I33MA

Overview

The Trenz Electronic TE0782-02-82I33MA is an industrial-grade System on Module based on the Xilinx Zynq-7000 SoC. It features a dual ARM Cortex-A9 MPCore processor and up to 254 FPGA I/Os with 16 GTX transceiver lanes supporting data rates up to 12.5 Gb/s per lane. The module integrates 1 GByte of 32-bit wide DDR3L SDRAM, 32 MByte QSPI Flash, and 4 GByte eMMC memory. It includes two Gigabit Ethernet PHYs and two high-speed USB 2.0 ULPI PHYs.

Feature Summary

• Industrial temperature range operation from -40°C to +85°C
• Integrated Lattice MachXO2 CPLD for system management and boot control
• Rugged design optimized for shock and high vibration environments
• Supports bit-stream encryption via eFUSE and AES

Applications

• High-speed data acquisition systems
• Embedded digital signal processing applications
• Industrial process control and measurement systems
• Automotive industry embedded solutions

Procurement Notes

Verify the specific SoC variant (XC7Z035, XC7Z045, or XC7Z100) required for the application. Confirm that the carrier board supports the 8.5 x 8.5 cm form factor and utilizes three 160-pin high-speed stacking strips. Ensure thermal management solutions are adequate for the operating environment, as the module's operating temperature range depends on the customer's cooling design.

Selection Notes

Select this module when rugged performance in industrial environments is required. The TE0782 offers a balance of processing power and connectivity through its integrated peripherals. Consider the available assembly options for cost or performance optimization if standard configurations do not meet specific project requirements. Verify compatibility with existing development tools and baseboard designs.

Part Context

Trenz Electronic GmbH specializes in FPGA and CPU-based embedded systems. The TE0782 series represents their high-performance SoM line designed for demanding applications. These modules are developed and manufactured in Germany, providing customers with reliable hardware for complex engineering projects requiring robust signal integrity and extensive I/O capabilities.

Replacement Considerations

Publicly confirmed direct substitutes are not identified in the provided documentation. Alternative modules within the Trenz Electronic portfolio may offer different form factors or SoC densities but require carrier board redesign due to varying pinouts and dimensions.