TE0782-02-92I33FA

Overview

The TE0782-02-92I33FA is an industrial-grade System on Module based on the Xilinx Zynq-7000 SoC. It features a dual ARM Cortex-A9 MPCore processor and integrates 1 GByte of 32-bit wide DDR3L SDRAM alongside 32 MByte Quad SPI Flash memory. The module provides 254 FPGA I/Os, including 16 GTX high-performance transceivers capable of data rates up to 12.5Gb/s per lane. Connectivity includes two Gigabit Ethernet PHYs and two Hi-Speed USB 2.0 ULPI PHYs.

Feature Summary

• Industrial temperature range operation from -40°C to +85°C
• Integrated Lattice MachXO2 CPLD for system management
• On-board programmable Si5338A quad PLL clock generator
• Temperature compensated real-time clock with battery backup

Applications

• High-speed serial communication systems utilizing GTX transceivers
• Industrial automation controllers requiring ruggedized processing
• Network infrastructure equipment with Gigabit Ethernet interfaces
• Embedded systems requiring secure bit-stream encryption via eFUSE

Procurement Notes

Verify that the specific ordering suffix corresponds to the required Zynq-7000 variant (XC7Z035, XC7Z045, or XC7Z100) and memory configuration. Confirm the operating temperature range aligns with the industrial specification. Ensure carrier board design supports the 3 x 160-pin high-speed stacking strip interface for proper signal integrity and power distribution.

Selection Notes

Select this module when a compact form factor is needed alongside significant FPGA logic resources and hard processor system capabilities. It is suitable for designs requiring multiple high-speed differential pairs and robust peripheral integration without external component count. Consider the available QSPI and eMMC storage options for boot and data persistence requirements.

Part Context

This module belongs to the Trenz Electronic TE0782 family of Zynq-7000 based System on Modules. These modules are designed for cost-effective performance in industrial applications. The family offers various configurations differing by SoC density, memory size, and peripheral options, all sharing the same 8.5 x 8.5 cm form factor and connector layout.

Replacement Considerations

Direct pin-to-pin replacements are not publicly confirmed for this specific module configuration due to the proprietary carrier interface and integrated peripherals. Alternative solutions require redesigning the carrier board to accommodate different form factors and connector types while matching the processing and I/O requirements.