TE0782-02-92I33FH

Overview

The TE0782-02-92I33FH is an industrial-grade System on Module based on the Xilinx Zynq-7000 SoC, specifically utilizing the XC7Z045 processor. It features a dual ARM Cortex-A9 MPCore and integrates 1 GByte of 32-bit wide DDR3L SDRAM alongside 32 MByte Quad SPI Flash memory. The module provides extensive connectivity through three 160-pin high-speed stacking strips, exposing 254 FPGA I/Os, 16 GTX transceiver lanes, two Gigabit Ethernet PHYs, and two USB ULPI PHYs. Designed for rugged environments, it operates within the -40°C to +85°C temperature range.

Feature Summary

• Industrial-grade system-on-module built around the Xilinx Zynq-7000 XC7Z045 SoC with dual ARM Cortex-A9 cores.
• Integrates 1 GByte DDR3L RAM and 32 MByte QSPI Flash for robust data storage and processing capabilities.
• Features rugged high-speed stacking strip connectors providing access to 254 FPGA I/Os and 16 GTX transceivers.
• Includes on-board peripherals such as Marvell Gigabit Ethernet PHYs, Microchip USB ULPI PHYs, and a programmable clock generator.

Applications

• Industrial automation systems requiring reliable processing in harsh environments
• Medical equipment needing compact, high-performance embedded solutions
• Aerospace and defense applications demanding ruggedized computing modules
• Test and measurement instruments requiring precise timing and signal processing

Procurement Notes

Verify that the specific suffix matches the required processor variant (XC7Z045) and memory configuration. Confirm compliance with industrial temperature specifications (-40°C to +85°C) for your application environment. Ensure carrier board design supports the 160-pin stacking interface and power requirements outlined in the technical reference manual.

Selection Notes

Select this module when a Zynq-7000 solution with integrated DDR3 and QSPI is required in an 8.5x8.5 cm form factor. Consider the TE0782-02 series for its balance of performance and cost-effectiveness. Verify that the available I/O count and transceiver lanes meet the interface demands of the target system design.

Part Context

This part belongs to the Trenz Electronic TE0782 family of Zynq-7000 System on Modules. These modules are designed to accelerate development by providing a pre-integrated hardware platform. The TE0782-02 variant specifically targets applications needing moderate processing power with significant I/O flexibility and rugged environmental tolerance.

Replacement Considerations

Direct replacements must match the Zynq-7000 architecture and physical footprint. Evaluate alternative modules from Trenz Electronic or other vendors offering similar SoC integration. Ensure compatibility with existing carrier board designs or plan for necessary interface adaptations.