TE0782-02-92I33MA

TE0782-02-92I33MA

$2,020.08
  • Description:IC MODULE CORTEX
  • Series:TE0782

SKU:cae3bc4120c1 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MODULE CORTEX
  • Series:TE0782
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM Cortex-A9
  • Co-Processor:Zynq-7000 (Z-7045)
  • Speed:-
  • Flash Size:32MB
  • RAM Size:1GB
  • Connector Type:Board-to-Board (BTB) Socket
  • Size / Dimension:3.350" L x 3.350" W (85.00mm x 85.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0782-02-92I33MA

Overview

The Trenz Electronic TE0782-02-92I33MA is an industrial-grade System on Module based on the Xilinx Zynq-7000 SoC. It features a dual ARM Cortex-A9 MPCore processor and integrates 1 GByte of 32-bit wide DDR3L SDRAM alongside 32 MByte Quad SPI Flash memory. The module provides 4 GByte eMMC storage, two Gigabit Ethernet PHYs, and two high-speed USB ULPI PHYs. It includes 16 GTX transceiver lanes and 254 FPGA I/Os accessible via three 160-pin stacking strips.

Feature Summary

  • Industrial temperature range operation from -40°C to +85°C
  • Integrated Lattice MachXO2 CPLD for system management
  • Temperature compensated real-time clock with battery backup
  • On-board programmable quad PLL clock generator

Applications

  • High-performance embedded digital signal processing systems
  • Rugged industrial data acquisition and measurement applications
  • Automotive infotainment and control units
  • Network communication gateways requiring multiple Ethernet interfaces

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to confirm availability and exact component revisions. Confirm that the required memory density and peripheral configurations match the standard TE0782-02 variant specifications. Ensure compatibility with the intended carrier board connector pitch and mechanical form factor before finalizing procurement.

Selection Notes

Select this module when a compact 8.5 x 8.5 cm footprint is required for Zynq-7000 processing power. Choose this variant if the design necessitates integrated Gigabit Ethernet and USB connectivity without external PHY components. Consider the rugged stacking strip interface for reliable connections in high-vibration environments compared to standard edge connectors.

Part Context

This module belongs to the Trenz Electronic TE0782 series, which utilizes the Xilinx Zynq-7000 architecture. The series offers various configurations based on different SoC densities and memory options. The TE0782-02 specifically denotes the version equipped with 1 GByte RAM and standard peripheral integration, designed for cost-effective high-performance embedded solutions.

Replacement Considerations

Direct replacements within the same form factor are limited due to unique pin mappings and BOM configurations. Evaluate other modules in the TE0782 family or the TE0727 series if lower performance requirements allow. Verify carrier board redesign efforts if switching between different SoC families such as Zynq UltraScale+ MPSoC.

TE0782-02-92I33MATE0782-02-92I33MA
$2,020.08
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