TE0782-02-A2I33FA

Overview

The TE0782-02-A2I33FA is an industrial-grade System on Module based on the Xilinx Zynq-7000 SoC, specifically utilizing the XC7Z045 variant. It features a dual ARM Cortex-A9 MPCore processor and integrates 1 GByte of 32-bit wide DDR3L SDRAM alongside 32 MByte Quad SPI Flash memory. The module provides extensive connectivity through two Gigabit Ethernet PHYs, two high-speed USB 2.0 ULPI transceivers, and four GByte eMMC storage. It includes sixteen GTX high-performance transceiver lanes for data rates up to 12.5 Gb/s per lane, supported by programmable clock generation and temperature-compensated real-time clock capabilities.

Feature Summary

• Industrial-grade rugged design suitable for shock and high vibration environments
• Integrated system management via Lattice MachXO2 CPLD firmware
• On-board high-efficiency switch-mode DC-DC converters for power distribution
• Supports eFUSE and AES bit-stream encryption for security

Applications

• Industrial automation and control systems requiring robust processing
• High-speed data acquisition and transmission applications
• Network infrastructure equipment with Gigabit Ethernet requirements
• Embedded systems needing secure boot and configuration storage

Procurement Notes

Verify the specific silicon revision and manufacturing date code against project requirements. Confirm that the initial delivery state matches the intended deployment, noting that user content in EEPROMs and eMMC is typically unprogrammed. Ensure compatibility with the carrier board's power supply sequence and voltage levels, particularly the 1.8V I/O standards used for peripherals. Check for any required assembly options for cost or performance optimization if standard configurations are insufficient.

Selection Notes

Select this module when a balance of high-performance FPGA fabric and embedded processing is needed within a compact 8.5 x 8.5 cm form factor. The XC7Z045 offers sufficient logic resources for complex designs while maintaining low power consumption. Consider the available I/O count and GTX lanes if high-speed serial communication is critical. Evaluate the onboard peripheral integration, such as the dual Ethernet and USB interfaces, to minimize external component count on the carrier board.

Part Context

This module belongs to the Trenz Electronic TE0782 family of Zynq-7000 based System on Modules. It is designed to interface with custom carrier boards via three 160-pin high-speed stacking strips. The family supports various Zynq-7000 devices, including the XC7Z035, XC7Z045, and XC7Z100, allowing for scalability across different performance tiers while maintaining a consistent mechanical and electrical interface.

Replacement Considerations

Direct replacements must match the Zynq-7000 architecture and pinout compatibility. Verify that alternative modules support the same memory configurations and peripheral integrations. Ensure the replacement maintains the industrial temperature range and physical dimensions to fit existing enclosures and mounting solutions.