TE0782-02-A2I33MA

Overview

The TE0782-02-A2I33MA is an industrial-grade System on Module based on the Xilinx Zynq-7000 SoC. It integrates a dual-core ARM Cortex-A9 MPCore processor with programmable logic featuring 16 GTX transceivers and 254 FPGA I/Os. The module includes 1 GByte of 32-bit wide DDR3L RAM, 32 MByte QSPI Flash, and 4 GByte eMMC storage. Connectivity is provided by two Gigabit Ethernet PHYs and two USB 2.0 ULPI PHYs. A Lattice MachXO2 CPLD manages system control functions.

Feature Summary

• Industrial temperature range operation from -40°C to +85°C
• Integrated Lattice MachXO2 CPLD for system management and power sequencing
• Rugged design suitable for high vibration and shock environments
• Supports eFUSE and AES bit-stream encryption for security

Applications

• Industrial automation controllers requiring rugged reliability
• High-speed data acquisition systems utilizing GTX transceivers
• Networked embedded devices with dual Gigabit Ethernet interfaces
• Secure embedded applications requiring hardware encryption capabilities

Procurement Notes

Verify that the specific model suffix corresponds to the intended Zynq-7000 variant (XC7Z035, XC7Z045, or XC7Z100) and memory configuration. Confirm the operating temperature range requirements match the industrial specification. Ensure carrier board designs account for the required stacking strip connectors and power distribution dependencies outlined in the technical reference manual.

Selection Notes

Select this module when a compact form factor is needed alongside significant processing power and high-speed serial connectivity. The integrated peripherals reduce external component count for standard interfaces like Ethernet and USB. Consider the CPLD's role in boot configuration and power monitoring when designing system-level firmware and hardware reset sequences.

Part Context

This module belongs to the Trenz Electronic TE0782 family of Zynq-7000 based System on Modules. These modules are designed for cost-effective integration into custom carrier boards using high-speed stacking strips. The family offers various configurations to balance performance, memory capacity, and thermal requirements for diverse industrial and commercial applications.

Replacement Considerations

Direct replacements depend on the specific Zynq-7000 SoC variant used within the module. Verify pin compatibility with the 3x 160-pin stacking strip interface. Alternative modules may require significant carrier board redesign due to differences in peripheral placement, voltage levels, and CPLD functionality.