TE0803-01-03CG-1EA

Overview

The TE0803-01-03CG-1EA is an industrial-grade System-on-Module integrating a Xilinx Zynq UltraScale+ MPSoC (XCZU3CG). It features up to 8 GByte of DDR4 SDRAM with a 64-bit data bus and dual SPI boot Flash memory totaling up to 512 MByte. The module provides high-speed connectivity via four Board-to-Board connectors, each containing 160 contacts. It supports up to eight Gigabit transceivers and includes on-board switch-mode power supplies for all internal voltages.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC in a 784-pin package
• Supports up to 8 GByte DDR4 SDRAM with 64-bit width
• Includes dual parallel SPI boot Flash memory configuration
• Features rugged high-speed stacking connections for I/O access

Applications

• Industrial automation and control systems
• High-performance embedded computing platforms
• Aerospace and defense electronics
• Medical imaging devices requiring FPGA flexibility

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to confirm availability and revision status. Ensure the carrier board design accommodates the required power domain sequencing and voltage levels specified in the technical reference manual. Confirm that the selected MPSoC variant matches the required transceiver count and memory capacity for the application.

Selection Notes

Select this module when a heterogeneous processing system with integrated programmable logic is required. The TE0803-01 supports multiple MPSoC options including ZU2CG, ZU3CG, and ZU4CG variants. Consider the number of available Gigabit Transceivers (GTH/GTR) and the maximum memory capacity needed. Ensure the carrier board can support the single 3.3V input requirement and the specific B2B connector pin assignments.

Part Context

This component belongs to the Trenz Electronic TE0803 family of System-on-Modules designed for the Xilinx Zynq UltraScale+ MPSoC platform. These modules are engineered for compact form factors while providing extensive I/O capabilities through standardized Board-to-Board connectors. The family supports various memory configurations and processor speeds to suit different performance tiers within the UltraScale+ ecosystem.

Replacement Considerations

Direct replacements depend on the specific MPSoC variant (e.g., ZU3CG vs. ZU4EV) and memory configuration. Verify compatibility with existing carrier board designs, particularly regarding B2B connector pinouts and power domain requirements. Check for any Product Change Notifications or End-of-Life notices from Trenz Electronic regarding the specific sub-model.