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The TE0803-01-04CG-1EA is an industrial-grade System-on-Module integrating a Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E MPSoC. It features up to 8 GByte of 64-bit DDR4 SDRAM and dual SPI boot Flash memory totaling 512 MByte. The module provides 65 MIO, 48 HD, and 156 HP user I/Os, alongside four GTR and four GTH serial transceivers. It operates within a temperature range of -40°C to +85°C and utilizes a single 3.3V power source with on-board switch-mode power supplies.
Verify the specific ordering suffix against the manufacturer's current production list to confirm availability and exact component revision. Confirm that the carrier board design supports the required power domain sequencing and voltage levels specified in the technical reference manual. Ensure compliance with regional regulatory standards such as CE or UKCA if applicable to the final deployment environment.
Select this module when high-performance processing combined with FPGA flexibility is required in a compact form factor. The XCZU4EV variant offers specific transceiver capabilities suitable for high-speed serial interfaces. Consider the available I/O banks and memory configurations to ensure compatibility with the target application's interface requirements and data throughput needs.
Trenz Electronic GmbH specializes in FPGA and SoC modules for industrial and automotive applications. The TE0803 series belongs to their UltraSoM product line, designed for rugged environments. These modules are developed and manufactured in Germany, providing engineering support and compatible baseboards for rapid prototyping and production deployment.
Consult the official Trenz Electronic documentation for confirmed substitute part numbers within the TE0803 family. Verify pinout and electrical compatibility before replacing existing units. No public cross-manufacturer substitutes are documented; alternative solutions may require significant carrier board redesign.