TE0803-01-04CG-1EA

TE0803-01-04CG-1EA

$573.75
  • Description:IC MODULE ZYNQ USCALE 2GB 128MB
  • Series:TE0803

SKU:2e2c17fa13e7 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MODULE ZYNQ USCALE 2GB 128MB
  • Series:TE0803
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU4CG-1SFVC784E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:B2B
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0803-01-04CG-1EA

Overview

The TE0803-01-04CG-1EA is an industrial-grade System-on-Module integrating a Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E MPSoC. It features up to 8 GByte of 64-bit DDR4 SDRAM and dual SPI boot Flash memory totaling 512 MByte. The module provides 65 MIO, 48 HD, and 156 HP user I/Os, alongside four GTR and four GTH serial transceivers. It operates within a temperature range of -40°C to +85°C and utilizes a single 3.3V power source with on-board switch-mode power supplies.

Feature Summary

  • Integrates Xilinx Zynq UltraScale+ MPSoC with heterogeneous processing system and programmable logic
  • Supports up to 8 GByte DDR4 SDRAM and dual parallel SPI Flash configuration
  • Includes onboard Si5338A programmable PLL clock generator for flexible timing
  • Features rugged board-to-board stacking connectors with 480 terminals

Applications

  • Industrial automation and embedded control systems
  • High-speed data acquisition and measurement devices
  • Automotive infotainment and advanced driver assistance systems
  • Telecommunications infrastructure equipment

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to confirm availability and exact component revision. Confirm that the carrier board design supports the required power domain sequencing and voltage levels specified in the technical reference manual. Ensure compliance with regional regulatory standards such as CE or UKCA if applicable to the final deployment environment.

Selection Notes

Select this module when high-performance processing combined with FPGA flexibility is required in a compact form factor. The XCZU4EV variant offers specific transceiver capabilities suitable for high-speed serial interfaces. Consider the available I/O banks and memory configurations to ensure compatibility with the target application's interface requirements and data throughput needs.

Part Context

Trenz Electronic GmbH specializes in FPGA and SoC modules for industrial and automotive applications. The TE0803 series belongs to their UltraSoM product line, designed for rugged environments. These modules are developed and manufactured in Germany, providing engineering support and compatible baseboards for rapid prototyping and production deployment.

Replacement Considerations

Consult the official Trenz Electronic documentation for confirmed substitute part numbers within the TE0803 family. Verify pinout and electrical compatibility before replacing existing units. No public cross-manufacturer substitutes are documented; alternative solutions may require significant carrier board redesign.

TE0803-01-04CG-1EATE0803-01-04CG-1EA
$573.75
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