TE0803-02-03EG-1EB

Overview

The TE0803-02-03EG-1EB is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E processor. It features 4 GByte of 64-bit width DDR4 SDRAM and 128 MByte SPI Boot Flash for configuration. The module operates within an extended temperature range of 0°C to +85°C and measures 5.2 x 7.6 cm. It utilizes rugged high-speed stacking connections with 48 High-density I/Os, 65 multi-use I/Os, and 156 high-performance I/Os.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ ZU3EG with GPU capabilities
• Includes onboard switch-mode power supplies requiring only a single 3.3V source
• Features rugged board-to-board stacking connectors for shock and vibration resistance
• Supports dual parallel SPI boot flash and serial EEPROM for MAC address storage

Applications

• Industrial embedded systems requiring high reliability
• High-speed data acquisition applications
• Embedded digital signal processing systems
• Prototyping for custom motor control algorithms

Procurement Notes

Verify the specific ordering suffix against the manufacturer's datasheet to confirm memory configurations and package details. Ensure the host baseboard design accommodates the 5.2 x 7.6 cm footprint and provides adequate cooling for the specified operating temperature range. Confirm availability through authorized distributors as supply status may vary.

Selection Notes

Select this module when a compact form factor is required alongside significant programmable logic resources and ARM processing power. The integrated power delivery simplifies system design by eliminating external voltage regulators. Consider the available baseboards and development tools if rapid prototyping is necessary for the target application.

Part Context

This module belongs to the Trenz Electronic TE0803 series, which focuses on providing high-density System-on-Modules based on AMD/Xilinx Zynq UltraScale+ MPSoCs. These modules are designed for industrial environments and are manufactured in Germany. The series offers various memory and interface options to suit different performance requirements.

Replacement Considerations

Check for updated revisions within the TE0803 family that may offer improved thermal performance or additional memory options. Verify compatibility with existing baseboard designs before switching to alternative SOM vendors, as connector pinouts and mechanical dimensions may differ significantly.