TE0803-02-04CG-1EB

Overview

The TE0803-02-04CG-1EB is an industrial-grade System-on-Module integrating the Xilinx Zynq UltraScale+ XCZU4CG-1SFVC784E processor. It features 2 GByte of 64-bit width DDR4 SDRAM and 256 MByte SPI Boot Flash for configuration. The module operates within an extended temperature range of 0°C to +85°C and requires a single 3.3V power source. It utilizes rugged high-speed stacking connections with 4 x 160 pin B2B connectors to provide access to programmable logic and processing system I/Os.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with dual parallel SPI boot flash
• Includes onboard switch-mode power supplies requiring only a single 3.3V input
• Features rugged board-to-board stacking connectors for shock and vibration resistance
• Supports multiple I/O types including MIO, HP I/Os, and serial transceivers

Applications

• Industrial automation and control systems
• Embedded computing platforms requiring high reliability
• Prototyping and development for FPGA-based designs
• Measurement and process control systems

Procurement Notes

This component is manufactured on demand and may not be immediately available in stock. Customers should contact the manufacturer or authorized distributors directly to inquire about current availability and specific minimum order quantities. Production lead times vary based on order volume and configuration requirements.

Selection Notes

Select this module when a compact form factor is required alongside significant processing power from the Zynq UltraScale+ architecture. Ensure the application environment stays within the specified 0°C to +85°C operating range. Verify that the host carrier board supports the 4 x 160 pin connector interface and provides the necessary 3.3V power supply.

Part Context

Trenz Electronic specializes in developing and manufacturing high-quality FPGA modules and System-on-Modules. Based in Germany, the company provides embedded technology solutions ranging from prototyping to series production. This module belongs to their TE0803 family, designed for applications demanding robust performance in industrial environments.

Replacement Considerations

No public confirmed substitutes are listed in the provided documentation. As this is a specialized System-on-Module, direct replacements require careful evaluation of pin compatibility, memory configurations, and thermal management requirements against the new candidate component.

FAQ

What is the physical footprint of the TE0803-02-04CG-1EB module?

The module has a compact dimension of 5.2 x 7.6 cm.

How many I/O banks are available on this module?

The module provides 48 High-density (HD) I/Os across 2 banks, along with 65 multi-use I/Os and 156 high-performance I/Os across 3 banks.

Is the module suitable for high-vibration environments?

Yes, the module uses rugged high-speed stacking connections designed to withstand shock and high vibration.