TE0803-02-04EG-1E3

TE0803-02-04EG-1E3

  • Description:IC MODULE ZYNQ USCALE 2GB 128MB
  • Series:TE0803

SKU:56a1a6536f56 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:IC MODULE ZYNQ USCALE 2GB 128MB
  • Series:TE0803
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU4EG-1SFVC784E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:B2B
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:0°C ~ 85°C

Download product information

TE0803-02-04EG-1E3

Overview

The TE0803-02-04EG-1E3 is a System-on-Module (SOM) manufactured by Trenz Electronic. It integrates an AMD Zynq UltraScale+ MPSoC, specifically the ZU3EG-1E variant, providing combined processing system and programmable logic capabilities. The module includes 2 GByte of DDR4 memory and measures 5.2 x 7.6 cm. Designed for embedded computing applications, it offers high-density interconnects suitable for industrial and professional environments requiring robust FPGA-based solutions.

Feature Summary

  • Integrates AMD Zynq UltraScale+ ZU3EG-1E MPSoC for mixed processing and logic tasks
  • Includes onboard 2 GByte DDR4 SDRAM for data handling
  • Compact form factor measuring 5.2 x 7.6 cm for space-constrained designs
  • Manufactured in Germany with engineering support for design-in

Applications

  • Industrial automation and control systems
  • High-speed data acquisition platforms
  • Embedded digital signal processing applications
  • Prototyping for custom FPGA-based hardware

Procurement Notes

Verify current availability status directly with Trenz Electronic or authorized distributors, as stock levels fluctuate. Confirm that the specific suffix matches the required ZU3EG-1E silicon revision and memory configuration. Request the latest datasheet and mechanical drawings to ensure compatibility with existing baseboard designs before finalizing procurement decisions.

Selection Notes

Select this module when a compact SOM is needed with Zynq UltraScale+ MPSoC performance. Ensure the host board supports the 5.2 x 7.6 cm footprint and provides necessary power delivery for the integrated DDR4 and MPSoC. Consider thermal management requirements for the ZU3EG device in the target enclosure environment during the initial design phase.

Part Context

Trenz Electronic specializes in FPGA and SoC modules for industrial and automotive sectors. This part belongs to their modular SOM portfolio, designed to accelerate development cycles. The company provides comprehensive engineering services, including hard- and software design support, ensuring seamless integration from prototype to series production for complex embedded systems.

FAQ

What is the primary processor core used in this module?

The module utilizes the AMD Zynq UltraScale+ ZU3EG-1E MPSoC, which combines ARM Cortex-A53 processors with Xilinx FPGA fabric.

Does the module include external flash memory?

The provided documentation specifies 2 GByte of DDR4 SDRAM. Configuration memory details should be verified against the specific datasheet for this SKU.

Is this module RoHS compliant?

Trenz Electronic products are generally developed and manufactured in Germany adhering to strict environmental standards; verify the specific RoHS declaration in the product datasheet.

TE0803-02-04EG-1E3TE0803-02-04EG-1E3

Click on the inquiry