TE0803-02-04EV-1EA

Overview

The TE0803-02-04EV-1EA is an industrial-grade System-on-Module integrating the Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E processor. It features 2 GByte of 64-bit width DDR4 SDRAM and 128 MByte SPI Boot Flash for configuration. The module measures 5.2 x 7.6 cm and includes a single 3.3V power source requirement with onboard switch-mode power supplies. It provides 65 multi-use I/Os, 156 high-performance I/Os, and serial transceivers.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with GPU and VCU capabilities
• Rugged board-to-board stacking connectors for shock and vibration resistance
• Onboard power delivery subsystem requiring only a single 3.3V input
• Supports skyline heat spreader mounting via 3 mm holes

Applications

• Industrial automation and control systems
• High-density embedded computing platforms
• Video processing and multimedia applications
• Harsh environment data acquisition systems

Procurement Notes

Verify the specific revision level and manufacturing date code against current production status. Confirm thermal management requirements with the manufacturer, as operating temperature depends on the customer's cooling solution and design. Ensure compatibility with the recommended base board for initial development and validation before final integration.

Selection Notes

Select this module when a compact footprint is required alongside significant programmable logic resources and processing power. The ZU4EV variant offers a balance of performance and pin count suitable for moderate I/O density. Consider the available Vivado Design Suite HLx Editions for partial reconfiguration support during software development.

Part Context

This module belongs to the Trenz Electronic TE0803 series, designed for space-constrained applications. It utilizes the Xilinx Zynq UltraScale+ architecture, combining ARM Cortex processors with FPGA fabric. The series is manufactured in Germany and targets industries requiring reliable, high-performance embedded solutions.

Replacement Considerations

No direct public substitutes are confirmed. Alternative modules within the same family may offer different memory configurations or processor variants but require verification of mechanical and electrical compatibility.