TE0803-03-2AE11-A

TE0803-03-2AE11-A

  • Description:IC MODULE ZYNQ USCALE 2GB 128MB
  • Series:TE0803

SKU:f87f602c08f5 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:IC MODULE ZYNQ USCALE 2GB 128MB
  • Series:TE0803
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU2CG-1SFVC784E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:B2B
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:0°C ~ 85°C

Download product information

TE0803-03-2AE11-A

Overview

The TE0803-03-2AE11-A is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC processor with integrated DDR4 memory. The module provides a compact form factor suitable for space-constrained designs, offering high-performance processing capabilities within a standardized modular architecture.

Feature Summary

  • Integrates AMD Zynq UltraScale+ MPSoC technology
  • Includes onboard DDR4 SDRAM for data processing
  • Compact mechanical footprint for dense integration
  • Supports rapid prototyping and production scaling

Applications

  • Industrial automation controllers
  • Medical imaging devices
  • Aerospace and defense avionics
  • Test and measurement equipment

Procurement Notes

Verify current availability status directly with the manufacturer or authorized distributors, as supply chain conditions may vary. Confirm that the specific ordering suffix matches the required processor speed grade and temperature range. Ensure compatibility with baseboard designs regarding pinout and power delivery specifications before procurement.

Selection Notes

Select this module when a balance of processing power and compact size is required for MPSoC-based designs. Consider the available I/O interfaces and memory capacity relative to application demands. Evaluate thermal management requirements based on the operating environment and computational load expected during operation.

Part Context

Trenz Electronic specializes in FPGA and SoM solutions, leveraging components from major semiconductor vendors like AMD and Xilinx. The TE0803 series represents their modular approach to embedded systems, providing pre-certified hardware to accelerate development cycles for engineers requiring reliable, scalable computing platforms.

TE0803-03-2AE11-ATE0803-03-2AE11-A

Click on the inquiry