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The TE0803-03-3AE11-A is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC architecture, specifically utilizing the ZU3EG device variant. The module includes 2 GByte of DDR4 memory to support high-bandwidth data processing requirements. Physically, the module measures 5.2 x 7.6 cm, providing a compact form factor suitable for space-constrained industrial and commercial designs.
Verify current availability status directly with Trenz Electronic or authorized distributors, as supply levels may fluctuate. Confirm that the specific suffix AE11 corresponds to the required temperature range and pinout configuration for your design. Request the latest datasheet and mechanical drawings to ensure compatibility with your carrier board interface before finalizing procurement decisions.
Select this module when an MPSoC solution combining ARM processors and programmable logic is required within a small footprint. Ensure the host system can accommodate the 5.2 x 7.6 cm dimensions and provides adequate power delivery for the ZU3EG core. Verify that the 2 GByte DDR4 capacity meets the memory bandwidth and storage needs of the target application software stack.
Trenz Electronic GmbH specializes in FPGA and SoC-based embedded solutions, manufacturing modules in Germany. The TE0803 series represents their modular system offerings based on Xilinx/AMD Zynq UltraScale+ technology. This specific part belongs to the computing subcategory, targeting applications requiring significant processing power and I/O flexibility in a standardized module format.
It uses the AMD Zynq UltraScale+ ZU3EG-1E MPSoC, which combines quad-core ARM Cortex-A53 processors with programmable logic.
The provided documentation specifies 2 GByte of DDR4 RAM but does not explicitly list onboard non-volatile flash storage capacity for this specific suffix; verification with the manufacturer is recommended.