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The TE0803-03-3BE11-A is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC architecture, specifically utilizing the ZU3EG device variant. The module includes 2 GByte of DDR4 memory to support high-speed data processing and storage requirements. Physically, the module measures 5.2 x 7.6 cm, providing a compact form factor suitable for space-constrained designs. This SOM serves as a complete computing solution, combining programmable logic and processing systems on a single board.
Verify current availability status directly with Trenz Electronic or authorized distributors, as supply conditions may vary. Confirm that the specific suffix -A matches your hardware revision requirements. Ensure compatibility with your carrier board design before procurement. Check for any end-of-life notifications or discontinuation notices associated with this specific module configuration.
Select this module when an AMD Zynq UltraScale+ ZU3EG processor is required within a compact SOM form factor. The 2 GByte DDR4 capacity supports moderate computational loads. Verify that the 5.2 x 7.6 cm dimensions fit your mechanical enclosure constraints. Consider thermal management solutions if operating in high-load scenarios, as the module integrates significant processing power in a small footprint.
Trenz Electronic specializes in FPGA and SoM solutions, offering modular systems based on major semiconductor vendors including AMD. The TE0803 series represents their MPSoC module lineup, designed for flexibility and scalability. These modules are intended to accelerate development cycles from prototyping to serial production, providing engineers with pre-validated hardware foundations for complex embedded projects.
Publicly confirmed direct substitutes for this exact part number are not available in the provided documentation. Engineers should evaluate other TE0803 series variants with different Zynq UltraScale+ processors or consider alternative SOM manufacturers if specific pinout or feature compatibility is required. Verify functional equivalence carefully when migrating between different module generations.