TE0803-03-4AE11-A

Overview

The TE0803-03-4AE11-A is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC processor with 2 GByte of DDR4 memory and 128 MB of flash storage. The module provides a compact solution for high-performance processing tasks, combining ARM Cortex-A53 cores with programmable logic capabilities.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC architecture
• Includes 2 GByte DDR4 system memory
• Features 128 MB non-volatile flash storage
• Provides modular System-on-Module form factor

Applications

• Industrial automation control systems
• Embedded vision processing units
• Portable medical instrumentation
• Automotive infotainment interfaces

Procurement Notes

Verify the specific revision level and pinout compatibility with your carrier board design before procurement. Confirm that the required thermal management solutions are included in your assembly plan, as the module generates significant heat during operation. Ensure that the supply chain source is authorized to guarantee component authenticity and traceability.

Selection Notes

Select this module when a compact footprint is required alongside substantial processing power from the Zynq UltraScale+ architecture. It is suitable for designs needing integrated FPGA logic and ARM processing without external memory controllers. Consider the 2GB DDR4 capacity for complex data handling requirements within space-constrained environments.

Part Context

This part belongs to the TE0803 family of modules from Trenz Electronic, which specializes in Xilinx-based embedded solutions. The TE0803 series typically utilizes various Zynq UltraScale+ variants, offering different performance tiers and memory configurations. This specific model focuses on balancing cost and performance with standard memory sizes.

Replacement Considerations

Direct substitutes include other TE0803 variants such as TE0803-03-4DE11-A or TE0803-03-2BE11-A, which share similar form factors but may differ in processor speed grades or memory specifications. Cross-compatibility with carrier boards should be verified against the specific pinout differences between these sibling models.