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The TE0803-03-4DE11-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC processor with integrated DDR4 memory. The module provides a compact form factor suitable for space-constrained industrial and commercial environments, offering high-performance processing capabilities within a standardized modular architecture.
Verify the specific revision level and manufacturing date code against current production status. Confirm availability through authorized Trenz Electronic distributors or direct channels, as supply chain conditions may vary. Ensure compatibility with required carrier board designs and software support packages before procurement.
Select this module when a balance of FPGA programmability and ARM processing power is required in a small form factor. Compare pinout compatibility with existing carrier board designs. Evaluate thermal management requirements based on the specific workload and ambient operating conditions to ensure reliable performance.
This component belongs to the TE0803 family of System-on-Modules from Trenz Electronic, which are built around Xilinx/AMD Zynq UltraScale+ devices. These modules are designed to accelerate development cycles by providing a pre-validated hardware platform that simplifies integration into custom end-products.
The module utilizes an AMD Zynq UltraScale+ MPSoC, combining programmable logic with dual-core ARM Cortex-A53 processors.
Yes, the TE0803 series modules typically integrate onboard DDR4 SDRAM for system memory operations.
Yes, the module is designed to operate within industrial temperature ranges, making it suitable for harsh environmental conditions.