TE0803-03-4DE21-L

Overview

The TE0803-03-4DE21-L is an industrial-grade System-on-Module integrating a Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E processor. It features 4 GByte of 64-bit width DDR4 SDRAM and 128 MByte dual parallel QSPI Flash memory for configuration. The module operates within an extended temperature range of 0°C to +85°C and utilizes rugged high-speed stacking connections with 4 x 160 pin B2B connectors.

Feature Summary

• Integrates Xilinx Zynq UltraScale+ MPSoC with GPU and VCU capabilities
• Includes onboard switch-mode power supplies requiring only a single 3.3V source
• Features low-profile 1 mm Samtec socket strips for compact integration
• Provides extensive I/O via 65 multi-use, 156 high-performance pins, and serial transceivers

Applications

• Industrial automation and control systems
• High-density embedded computing platforms
• Video processing and graphics-intensive applications
• Ruggedized environments requiring shock and vibration resistance

Procurement Notes

This component is manufactured on demand rather than held in standard stock. Customers must contact the manufacturer or authorized distributors directly to inquire about minimum order quantities and current availability. Documentation status may vary as the product has been recently developed; verify specific datasheet completeness before finalizing procurement plans.

Selection Notes

Select this module when a credit-card-sized footprint is required alongside significant processing power. It serves as a direct replacement for the TE0803-02-04EV-1E3 variant. Designers should account for thermal management solutions, as the operating temperature range depends on the customer's specific cooling strategy and board design.

Part Context

Trenz Electronic GmbH develops and manufactures these modules in Germany, specializing in high-speed data acquisition and embedded digital signal processing systems. The TE0803 series represents their modular approach to providing flexible, high-performance computing solutions based on AMD/Xilinx FPGA and SoC architectures for industrial and automotive sectors.

Replacement Considerations

This module replaces the TE0803-02-04EV-1E3. While functionally identical to the TE0803-xx-4DE11-A variant regarding core specifications, it differs by utilizing lower 1 mm profile Samtec socket strips and incorporating 4 GByte DDR4 SDRAM instead of other memory configurations.