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The TE0803-03-5DE11-A is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+ XCZU5EV-1SFVC784E processor. It features 2 GByte of 64-bit width DDR4 SDRAM and 128 MByte SPI Boot Flash for configuration. The module measures 5.2 x 7.6 cm and utilizes rugged high-speed stacking connections with 4 x 160 pin B2B connectors. It includes a GPU, VCU, and extensive I/O options including 65 MIOs and 156 HP I/Os.
Verify the specific revision status against the Product Change Notification (PCN) as this article replaces TE0803-02-05EV-1EA. Confirm that the extended temperature range of 0°C to +85°C aligns with your thermal design, as the actual operating range depends on the customer's cooling solution. Ensure compatibility with the recommended Vivado Design Suite HLx Editions for development support.
Select this module when a compact 5.2 x 7.6 cm footprint is required alongside significant processing power from the ZU5EV. It is suitable for designs needing integrated graphics and video processing capabilities without external memory controllers. Consider the available base boards and reference designs for faster integration. Verify that the 48 HD I/Os and 156 HP I/Os meet the interface requirements of the target application.
Trenz Electronic manufactures this System-on-Module in Germany, specializing in FPGA and CPU-based embedded systems. The TE0803 series provides modular computing solutions compatible with various form factors. This specific model targets applications demanding robust performance in industrial environments, leveraging Trenz Electronic's engineering expertise in high-speed data acquisition and measurement systems.
This module serves as the replacement for the TE0803-02-05EV-1EA. All changes resulting from the new revision are documented in the associated Product Change Notification. Engineers should review the PCN to assess any impact on existing designs or software configurations before transitioning production.