TE0803-04-2AE11-A

Overview

The TE0803-04-2AE11-A is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC architecture, specifically utilizing the ZU3EG device variant. The module includes 2 GByte of DDR4 memory to support high-performance processing and data handling requirements. Physically, the module measures 5.2 x 7.6 cm, providing a compact form factor suitable for space-constrained industrial and commercial designs.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC with ZU3EG processor core
• Includes 2 GByte DDR4 SDRAM for system memory
• Compact 5.2 x 7.6 cm form factor for embedded integration

Applications

• Industrial automation controllers requiring mixed processing capabilities
• Embedded vision systems leveraging FPGA programmable logic
• Medical imaging devices needing real-time data processing
• Telecommunications infrastructure nodes

Procurement Notes

Verify current availability status directly with Trenz Electronic or authorized distributors, as supply conditions may vary. Confirm that the specific suffix -2AE11-A matches the required performance grade and package type for your design. Ensure compatibility with existing carrier boards or plan for custom PCB development based on the module's pinout specifications.

Selection Notes

Select this module when a combination of ARM Cortex-A53/A9 processors and programmable FPGA fabric is required within a small footprint. The ZU3EG variant offers a balanced resource set for moderate complexity designs. Consider thermal management solutions appropriate for the operating environment, as the MPSoC generates significant heat during active computation.

Part Context

This component belongs to the TE0803 series of System-on-Modules from Trenz Electronic. The series focuses on Xilinx/AMD Zynq UltraScale+ MPSoC technologies, providing developers with pre-validated hardware platforms. These modules simplify the integration of complex SoCs into end products by handling high-speed signal integrity and power delivery challenges inherent in MPSoC designs.