TE0803-04-2BE11-A

TE0803-04-2BE11-A

$328.10
  • Description:IC MODULE ZYNQ USCALE 2GB 128MB
  • Series:TE0803

SKU:1dccfc359916 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MODULE ZYNQ USCALE 2GB 128MB
  • Series:TE0803
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU2EG-1SFVC784E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:B2B
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0803-04-2BE11-A

Overview

The TE0803-04-2BE11-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC architecture, combining programmable logic with processing system capabilities. The module includes 2 GByte of DDR4 memory to support high-bandwidth data processing tasks. Its physical dimensions are specified as 5.2 x 7.6 cm, facilitating integration into compact industrial and commercial designs requiring robust FPGA-based performance.

Feature Summary

  • Integrates AMD Zynq UltraScale+ ZU3EG-1E processor
  • Includes 2 GByte DDR4 SDRAM for high-speed data handling
  • Compact form factor suitable for space-constrained embedded systems

Applications

  • Industrial automation controllers
  • Medical imaging devices
  • Telecommunications infrastructure
  • Automotive infotainment systems

Procurement Notes

Verify the specific suffix configuration against official Trenz Electronic documentation to ensure compatibility with required interfaces and memory types. Confirm current availability status directly with authorized distributors or the manufacturer, as supply levels for specialized SOMs may fluctuate. Ensure that the selected variant meets all environmental and regulatory requirements for the target deployment region.

Selection Notes

Select this module when a balance of processing power and programmability is required within a small footprint. The ZU3EG device offers sufficient resources for complex signal processing and control loops. Evaluate thermal management solutions based on the specific load conditions, as the module density requires adequate heat dissipation in enclosed enclosures.

Part Context

This component belongs to the TE0803 family of System-on-Modules from Trenz Electronic. These modules are engineered to accelerate development cycles for FPGA and SoC projects. The family provides standardized interfaces and mechanical footprints, allowing engineers to prototype quickly before transitioning to custom carrier boards for mass production environments.

TE0803-04-2BE11-ATE0803-04-2BE11-A
$328.10
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