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The TE0803-04-3AE11-A is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC, specifically the ZU3EG-1E variant, providing combined processing system and programmable logic capabilities. The module includes 2 GByte of DDR4 memory to support high-bandwidth data operations. Physically, the module measures 5.2 x 7.6 cm, offering a compact form factor suitable for space-constrained industrial and commercial designs requiring robust FPGA-based processing.
Verify current availability status directly with Trenz Electronic or authorized distributors, as supply levels for specific MPSoC variants may fluctuate. Confirm that the ZU3EG-1E silicon revision matches your design requirements. Ensure compatibility with baseboard designs supporting the specified 5.2 x 7.6 cm footprint and DDR4 signal integrity guidelines provided in the official datasheet.
Select this module when a balance between processing power and physical size is required for Zynq UltraScale+ applications. The ZU3EG-1E offers sufficient resources for moderate complexity logic designs. Consider the 2 GByte DDR4 capacity against application memory demands. Verify that the operating temperature range and interface requirements align with the target environment before finalizing the component choice.
This part belongs to the Trenz Electronic TE0803 series of System-on-Modules based on Xilinx/AMD Zynq UltraScale+ MPSoCs. The series provides modular solutions for developers seeking to accelerate time-to-market for FPGA-based embedded systems. The TE0803 line typically supports various memory configurations and form factors, allowing customization for specific performance and size constraints within the broader ecosystem of Zynq-based development platforms.