TE0803-04-3AE11-AK

TE0803-04-3AE11-AK

$404.60
  • Description:MPSOC MODULE TE0803 WITH ZYNQ UL
  • Series:TE0803

SKU:f0181671ae73 Category: Brand:

  
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Product Detailed Parameters

  • Description:MPSOC MODULE TE0803 WITH ZYNQ UL
  • Series:TE0803
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU3CG-1SFVC784E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:Board-to-Board (BTB) Socket - 160
  • Size / Dimension:2.990" L x 2.050" W (76.00mm x 52.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0803-04-3AE11-AK

Overview

The TE0803-04-3AE11-AK is a System-on-Module manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ MPSoC architecture, combining programmable logic with a quad-core ARM Cortex-A53 processor and dual-core Cortex-R5 real-time processors. The module includes integrated DDR4 memory to support high-bandwidth data processing requirements.

Feature Summary

  • Integrates AMD Zynq UltraScale+ MPSoC for combined FPGA and processor functionality
  • Includes onboard DDR4 SDRAM for system memory
  • Compact form factor suitable for space-constrained designs
  • Supports industrial temperature ranges for rugged environments

Applications

  • Industrial automation and control systems
  • Medical imaging devices requiring low power consumption
  • Aerospace and defense avionics subsystems
  • Automotive infotainment and telematics units
  • Telecommunications infrastructure equipment

Procurement Notes

Verify the exact suffix configuration against official Trenz Electronic documentation to ensure compatibility with specific carrier boards. Confirm current availability status as supply chain conditions may affect delivery schedules. Request updated datasheets and mechanical drawings prior to final design integration to avoid pinout mismatches.

Selection Notes

Select this module when a compact solution is required that combines FPGA flexibility with ARM processing capabilities. Ensure the target application benefits from the specific memory capacity and I/O interfaces provided by the ZU3EG variant. Evaluate thermal management requirements based on the module's power dissipation characteristics in the intended enclosure.

Part Context

This component belongs to the Trenz Electronic XMOD family of System-on-Modules. These modules are engineered to accelerate development cycles by providing pre-certified hardware platforms. They serve as core processing units for custom carrier boards developed by system integrators and OEMs across various industrial sectors.

Replacement Considerations

Direct replacements must match the Zynq UltraScale+ ZU3EG processor specification and physical footprint. Verify electrical compatibility of the DDR4 interface and power delivery requirements. Consult Trenz Electronic for any newer revisions or alternative modules within the same product line that offer enhanced performance or extended lifecycle support.

TE0803-04-3AE11-AKTE0803-04-3AE11-AK
$404.60
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