TE0803-04-3BE11-A

TE0803-04-3BE11-A

$419.05
  • Description:IC MODULE ZYNQ USCALE 2GB 128MB
  • Series:TE0803

SKU:b0ab2d0a3695 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MODULE ZYNQ USCALE 2GB 128MB
  • Series:TE0803
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:Zynq UltraScale+ XCZU3EG-1SFVC784E
  • Co-Processor:-
  • Speed:-
  • Flash Size:128MB
  • RAM Size:2GB
  • Connector Type:B2B
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:0°C ~ 85°C

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TE0803-04-3BE11-A

Overview

The TE0803-04-3BE11-AZ is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates an AMD Zynq UltraScale+ ZU3EG-1E MPSoC processor with 2 GByte of DDR4 memory. The module features a compact form factor measuring 5.2 x 7.6 cm, providing a robust platform for high-performance processing tasks within a modular architecture.

Feature Summary

  • Integrates AMD Zynq UltraScale+ ZU3EG-1E MPSoC for mixed-signal programmable logic and dual-core ARM Cortex-A53 processing
  • Includes 2 GByte DDR4 SDRAM for high-bandwidth data handling
  • Utilizes a standardized modular SOM design for simplified carrier board integration

Applications

  • Industrial automation and control systems requiring real-time processing
  • Medical imaging devices needing high-throughput data acquisition
  • Automotive infotainment and instrument cluster displays
  • Test and measurement equipment with FPGA-based signal processing

Procurement Notes

Verify the specific suffix 'AZ' against official Trenz Electronic documentation to confirm environmental compliance and revision status. Ensure compatibility with the intended carrier board interface before procurement. Check current availability as stock levels may vary. Confirm that the ZU3EG-1E variant meets all performance requirements for the target application.

Selection Notes

Select this module when a balance of processing power and moderate I/O density is required. The ZU3EG device offers sufficient resources for complex algorithms while maintaining a smaller footprint compared to higher-end ZU variants. Consider thermal management solutions suitable for the 5.2 x 7.6 cm package size during system design.

Part Context

This component belongs to the TE0803 family of System-on-Modules from Trenz Electronic. These modules are engineered to accelerate development cycles by providing pre-validated hardware platforms based on Xilinx/AMD Zynq UltraScale+ MPSoCs. The family supports various memory configurations and form factors to suit different industrial and commercial constraints.

TE0803-04-3BE11-ATE0803-04-3BE11-A
$419.05
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