TE0803-04-4AE11-AZ

Overview

The TE0803-04-4AE11-AZ is a System-on-Module (SOM) manufactured by Trenz Electronic. It integrates an AMD Zynq UltraScale+ MPSoC, specifically the ZU3EG variant, providing combined processing system and programmable logic capabilities. The module includes 2 GByte of DDR4 memory and measures 5.2 x 7.6 cm. It is designed for embedded computing applications requiring high performance and low power consumption within a compact form factor.

Feature Summary

• Integrates AMD Zynq UltraScale+ MPSoC with ZU3EG device
• Includes 2 GByte DDR4 SDRAM for main memory
• Compact 5.2 x 7.6 cm form factor suitable for space-constrained designs
• Supports modular system integration for rapid prototyping

Applications

• Industrial automation controllers
• Medical imaging systems
• Aerospace and defense avionics
• High-performance embedded computing platforms

Procurement Notes

Verify availability directly with Trenz Electronic or authorized distributors as stock status may vary. Confirm the specific suffix -AZ corresponds to the required temperature grade and revision. Ensure compatibility with carrier boards supporting the 5.2 x 7.6 cm footprint and pinout definitions provided in the official datasheet before procurement.

Selection Notes

Select this module when an AMD Zynq UltraScale+ ZU3EG processor is required with 2GB DDR4. Compare against other TE0803 variants for different memory sizes or processor speeds. Ensure the carrier board design supports the necessary I/O interfaces and power delivery specifications outlined in the technical documentation.

Part Context

This part belongs to the Trenz Electronic TE0803 series of System-on-Modules. The series focuses on integrating Xilinx/AMD Zynq UltraScale+ MPSoCs into standardized, ruggedized modules. These modules are intended to accelerate development cycles for complex embedded systems by providing a pre-validated hardware foundation.

Replacement Considerations

Check for direct substitutes within the TE0803 family offering similar ZU3EG configurations. Verify mechanical compatibility with existing carrier boards. Consider newer revisions if available, ensuring pin-to-pin compatibility or assessing necessary design changes for any functional updates.